本實驗利用化學浴沉積法(Chemical Bath Deposition)進行氧化亞銅薄膜製備,沉積薄膜的基板為純度99.96%的銅基板,並使用硫酸銅(CuSO4)和硫酸鋅(ZnSO4)水溶液調配後進行沉積。改變ZnSO4的劑量,使其控制Cu2O:Zn 薄膜中不同莫耳濃度比的摻雜濃度。ZnSO4對CuSO4的莫爾濃度比範圍為(0:1)到(0.7:1)。 在熱探針量測法(Hot probe experiment) 量測證明CBD所成長的Cu2O 薄膜的是N型;利用SIMS量測得知經由CBD所成長的氧化亞銅薄膜厚度約為2μm;而I-V量測結果換算可得在未摻雜的氧化亞銅電阻係數約為75Ω-cm,摻雜鋅之後可以達到約49 Ω-cm;根據XRD量測結果顯示(111)面為我們所要的氧化亞銅薄膜成長晶向;經由SEM觀察得知晶粒大小約為0.5~2μm;在低溫下PL量測的光譜中顯示出約716nm(1.73eV)和約 650nm(1.91eV)有明顯的發光,分別為二價氧空缺及鋅摻雜所造成的發光。
In this study, the Cu2O thin films were deposited by chemical bath deposition. The substrate of thin films were used by copper substrates that were the purity of 99.96 %. The solution deploy CuSO4 and ZnSO4. The thin films of Cu2O:Zn were doping different concentration by changing ZnSO4 dosage. The range that is molality ratio of ZnSO4 to CuSO4 is (0:1) to (0.7:1). According to the Hot probe experiment, the Cu2O thin films were N-type. The SIMS results showed that the thickness of Cu2O thin films were about 2m. After n-Cu2O doping, the resistivity can be reduced to 49Ω-cm from 75Ω-cm. According to the XRD results, Cu2O kept the texture of prominent (111) plane. Furthermore, a large amount of grains with size of about 0.5~2m were found. Low temperature PL measurement showed a significant result of two broad peak from 716nm(1.73eV) and 650nm(1.93eV). Those were Vo++ and caused by Zn doping.