立體振膜式微機電麥克風製作

Fabrication of MEMS Microphone with 3-D Diaphragm

莊曜維(Yao-Wei Chuang)

指導教授 ： 陳建亨

國立暨南國際大學/科技學院/電機工程學系/碩士(2012年)

摘要

本篇論文主要是利用微機電製程技術製作出立體振膜式微機電麥克風，利用TEOS氧化層階梯蝕刻與階角圓弧化進行製作立體結構，沉積多晶矽做為振膜，最後藉由犧牲層掏空技術來完成立體振膜式微機電麥克風，以高倍率電子顯微鏡對製作完成之結構進行觀察，最後進行C-V與變形量特性量測。
由高倍率電子顯微鏡的觀察可知，立體振膜式微結構已順利完成，與平面式振膜式微機電麥克風比較，立體振膜式微機電麥克風最後將有較佳之感度。

關鍵字

立體振膜 ； 圓弧化

並列摘要

In this thesis, the MEMS microphone with 3-D diaphragm was fabricated. The 3-D structures were fabricated by etching of TEOS oxide and the rounding of step coners. The poly-Si was deposited on the 3D structure as the diaphragm. The 3-D diaphragm was released by the sacrificial process of TEOS oxide. The SEM was used to study the cross-section and top-view of the 3-D structures. The C-V curve and the deformation characterization were also studied.
In our results, the 3-D diaphragm was fabricated successfully. The MEMS microphone with 3-D diaphragm can show better sensitivity, comparing to the traditional planar diaphragm one.

並列關鍵字

3-D diaphragm ； rounding

參考文獻

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[5]M. Royer, J. O. Holmen, M. A. Wurm, O. S. Aadland and M. Glenn, "ZnO on Si Integrated Acoustic Sensor",Sensors and Actuators, 4, pp. 357-362, 1983.