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  • 學位論文

整合紅外線溫度感測器操作於1V之被動式2.45GHz RFID詢答器設計

Design of 1-V 2.45GHz Passive RFID Transponder with Integrated Infrared Sensor

指導教授 : 許孟烈

摘要


本論文設計並實現一整合紅外線溫度感測器操作於1V之被動式2.45GHz RFID詢答器晶片,此晶片包含了溫度感測器、讀取電路、逐漸趨近式類比至數位轉換器(SAR ADC)與被動式無線射頻辨識詢答器(RFID)。 溫度感測器是採用微機電(MEMS)製程,設計一甕形結構體(Urn-Shaped Structure),以蝕刻的方式將金屬層刻出孔洞,使紅外線在此結構體中產生繞射與多重反射現象,以利提升能量的吸收率。SAR ADC採用雙頻(Dual-Frequency)的工作模式,使取樣時間得以配合低反應速率的熱感測器與讀取電路,並維持SAR ADC本身的高轉換速率。RFID詢答器以接收距離一公尺的0.5W EIRP 2.45GHz 250mVpp的射頻訊號來驅動與供應能量。 本論文採用國家晶片系統設計中心所提供的TSMC 0.18μm 1P6M CMOS-MEMS製程來設計與實現此晶片。熱感測器與讀取電路的操作電壓在1V時,溫度感測範圍與輸出電壓分別為:-25℃ ~ 95℃與236mV ~ 901mV,靈敏度約為5.54mV/℃,功率消耗約為70μW;相對於ADC的數位輸出為00111010(58)~11101000(232)。SAR ADC操作電壓於1V,工作頻率為2.4MHz,輸入弦波頻率為40.3125KHz時,SNDR為49.467 dB,ENOB為7.925-bit,功率消耗為2.8043μW,FOM為48.08 fJ/conversion。整體晶片面積(含PAD)為950.545×965.04μm2,功率消耗約為85μW。

並列摘要


In this thesis, a 1-V 2.45GHz passive RFID transponder with integrated infrared sensor is presented.The chip contains temperature sensor, readout circuit, SAR ADC and passive RFID.The temperature sensor of the urn-shaped structure uses MEMS process to etch a cavity in the metal later for resulting diffraction and multiple-reflection in the etched cavity to increase the absorbed infrared energy.The SAR ADC adopts the dual-frequency method to generate a 2.4KHz clock for sample and hold, and a 2.4MHz for digital code conversion. The RFID transponder chip can receive 0.5W EIRP 2.45GHzincident RF signal from 1-meter to drive circuit and supply the energy. The chip is implemented using TSMC 0.18μm 1P6M CMOS-MEMS process provided by CIC.The thermal sensor and readout circuit work at 1V power supply, and the power consumption is less than 70μW. When tempeteature changes from -25℃ ~ 95℃, the voltage output is 236mV ~ 901mV and the digital output is 00111010 ~ 11101000.The simulation results of the ADC show that the SNDR and ENOB are 49.467 dB and 7.925-bit at 240KS/s sampling rate, respectively and 2.8125KHz input frequency with power consumption of 2.8043μW from a 1V supply voltage.The FOM is 48.08 fJ/conversion.The whole chip area is 950.545×965.04μm2, and power consumption less than 85μW.

參考文獻


[1] K. Finkenzeller and D. MAuller, RFID Handbook: Fundamentals and Applications
in Contactless Smart Cards, Radio Frequency Identi‾cation and Near-Field
Communication, 3rd ed. John Wiley & Sons, 2010. [Online]. Available:
http://books.google.com.tw/books?id=jAszZEQYa9wC
[2] V. Chawla and D. S. Ha, "An overview of passive RFID," IEEE Communications

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