在整個半導體產業快速增長的時代,台灣於2001年推動兩兆雙新產業,為台灣經濟帶來龐大的貢獻,台灣IC封裝產業至今的表現是相當亮眼,2011至2012年台灣IC封測產業產值市佔率為全球第一。要維持半導體產業正常運作,經營的策略是重要方向,IC封測產業需要大量的人力與資金投入,其主要花費於採購設備上,依據工研院統計2011年資本支出占銷收額的20%以上,且近年來國際大廠IDM與IC設計業委外檢測需求增加,IC封測業的專業測試能力必然相對需要進步。 本研究主要回顧半導體產業,並以較為客觀的績效研究方法資料包絡分析法,來探討台灣IC封測產業,如何在全球高度競爭壓力下,及在景氣波動的起伏當中,減少資源的不當浪費,精進成本控制,改善經營策略,以建立起同産業間的相對競爭力。除可輔助產業提昇經營績效及規劃產能方向,亦對於IC產業上、中、下游供應鏈的整合擬定更完善的參考與依據。
In an era of rapid growth throughout the semiconductor industry in Taiwan in 2001 to promote a new pair of two trillion industry, Taiwan's economy has brought a huge contribution, Taiwan IC packaging industry's performance so far is quite dazzling and IC packaging and testing industry in Taiwan market share of the world output from 2009 to 2011. To maintain the normal operation of the semiconductor industry, business strategy is an important direction, IC packaging and testing industry requires a lot of manpower and capital investment, which mainly spent on the procurement of equipment, according to ITRI statistics 2011 capital spending accounted for 20% of the amount of sales receipts or more, and the increase in recent years with international companies IDM outsourcing detection IC design industry demand, IC packaging and testing industry expertise needed to test the relative ability of inevitable progress. In this study, a review of the semiconductor industry, and a more objective performance research methods data envelopment analysis to explore Taiwan's IC packaging and testing industry, how in the world's highly competitive pressures, and the ups and downs of business cycles which reduce improper waste of resources, sophisticated cost control, improve business strategy to establish the relative competitiveness among different industries. In addition to supporting industries to improve business performance and capacity planning direction, but also for the IC industry, the downstream supply chain integration to develop a more complete reference and basis.