全球性競爭越來越激烈,顧客要求不再只有價格,品質要求也越來越重要。表面黏著技術(Surface Mount Technology, SMT)製程影響因素繁多,本研究主要利用工廠品質改善的手法,改善現有問題流程而獲得相當不錯的成果。從本研究的案例分析中,在管理面和技術面有許多的發現。如:在多班制的SMT生產模式中,錫膏控管亦為影響品質一大要因,若是印刷製程對錫膏進出導入 e化管理,可以方便統一掌控相關使用錫膏記錄與管控,對於品質改善會有助益;以表面黏著技術生產製程改善,光學檢查機、錫膏測厚機的回饋功能,可以縮短製造週期,提升策略性產品的良率;使用失效模式分析可以預測設計的功能失效後,如何在產品量產還未定案前,變更設計預防此失效的發生,此作法可以將品質管理從檢驗及製造,昇級到設計階段就考量品質因素,如此可以大幅度的提升產品的品質與可靠度,可以讓公司增加競爭力。本研究的結論可以提供給企業參考。
The Global competition is getting more serious. The requirement of consumers is not only caring the product price but also the product quality. In the process of Surface Mount Technology (SMT), there are many factors could infuluce quality. In this research, the implementation of quality improvement on SMT process is demonsated and some findings of qulity improment are obtained. The first finding, the stock management of solder paste is one of the main factors relating to the product quality in the multi-shift production mode of SMT. In this case, the method of the solder paste stock system was tansfered from manual comtrol to e-control. The new method increases the solder paste quality which increases the process quality yield. The second finding, using the feedback function of SMT optical inspection machine to check solder paste thinkness can shorten the manufacturing cycle and incerase the yield rate. The third finding, Failure Mode and Effects Analysis (FMEA) is used to detect the the function failure at the design phase, it will prevent the funcation failure before mass production of products. Therefore, the tool of FMEA can help the company increase the quality and reliability of products. It can enhance the company competition as well. The conclusions in the study can offer to the enterprises as a reference.