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  • 學位論文

多層鉻材料做黑色矩陣之製程參數對彩色濾光片應用的影響

Effect of processing parameters for black matrix with multiple chromium related layers on its properties in color filter application

指導教授 : 張慎周

摘要


黑色矩陣(Black Matrix)的目的是要防止色純度的低下,因此BM須達到高遮光性和pattern 的高細線化,目前BM的材料以金屬Cr 為主。光遮斷用BM材料以往是使用濺鍍(SPUTTERING)法形成的多層金屬鉻(CHROMIUM BM),因為運用濺鍍法所製成的金屬鉻膜和其他金屬相比下反射率較小,且和玻璃基板的密著性亦較優越,又因僅僅只有0.15μm的膜厚,就可以得到相當高的光學濃度,因此幾乎是目前形成彩色濾光片的製造法要素之ㄧ。 目前業界仍使用低反射的多層鉻薄膜做為黑色矩陣,但是黑色矩陣在蝕刻的製作過程中,常因為黑色矩陣中的鉻及氧化鉻薄膜蝕刻速率不相同,而產生底切效應,降低了它的良率以及影響到成品的畫質。 本實驗把黑色矩陣中的多層鉻薄膜經由氫氣退火,然後進行薄膜的蝕刻特性、光學性質之研究。經實驗結果得知,多層鉻薄膜經氫氣退火後光穿透率微量上升,光學濃度微量下降。在蝕刻方面,蝕刻速率隨著蝕刻液濃度及時間的增加而變快。對縱向蝕刻而言,退火後可使縱向蝕刻速率下降,對橫向蝕刻而言,退火後可使橫向過蝕刻速率下降,大約下降了13.5~13.8%,且退火製程也降低了蝕刻製程中底切效應的發生。

並列摘要


The function of black matrix (BM) used in color filter is to avoid color interference. The usual needs for BM pattern are high light optical density and fine line width. Most material Most BM used material is chromium (Cr) and its compound combination in today display market. As compared to other metal, Cr has low light reflectivity and good adhesion with glass. Multilayered Cr/Cr compound films are usually produced by sputtering method. As compared to other metal, Cr has low optical reflectivity and good adhesion with glass. Furthermore, only 0.15μm film thickness of Cr can exhibit high optical density. The etching rates with respect to Cr and CrOx are usually different during BM processing. Undercuts are therefore produced. This decreases production yield and color quality in color filter application. Multilayered Cr/Cr compound films were first annealed in hydrogen atmosphere followed by studying etching and optical properties of the films in this work. The experimental result shows after hydrogen annealing, optical density does not change much; vertical and lateral etching rates are decreased. Lateral etching rate is decreased about 13.5~13.8%. The annealing process seems improving undercut effect.

並列關鍵字

black matrix chromium color filter

參考文獻


[25]劉文岳,“射頻殂控濺鍍養新薄膜電性與光學特性之研究” ,國立成功大學研究所論文,2000.
[9]B. Chapman, Glow Discharge Processes, John Wiley & Sons, 1980.
[10]T. Chevolleau and W. Fukarek,“Ion Flux, Ion Energy Distribution and Neutral Density in An Inductively Coupled Argon Discharge”,Plasma
Sources Sci. Technol.,vol.9,pp.568-573,2000.
[11]K. K. Schuegraf, Handbook of Thin-Film Deposition Processes And Techniques, Noyes Publications,1988.

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