- 學位論文
光電半導體暨相關電子業之揮發性有機污染物排放特徵研究
Characteristics of VOC Emission from Photoelectric Semiconductor and Relative Electrical Industries
摘要
本研究之目的為探討光電半導體業電子業揮發性有機物使用排放特徵 (包括風量及排放量、成分及毒性、排放係數)，比較檢測法、質量平衡法及排放係數法推估其VOC排放量之差異性並討論其適用性。 6家光電業使用VOC特徵成份至少有25種，其中異丙醇占27.6％、BDG 24.9％、MEA 21.6％、乙二醇 9.6％及DMSO 4.7％，合計5種物料共佔88.4 ％，其它20種僅佔11.6％，有害空氣污染物(HAPs)成分有甲苯、二氯甲烷、二甲苯及醋酸丁酯等4種。6家光電業生產彩色濾光片+TFT-液晶顯示器之VOC總排放係數為1.03公斤VOC/公斤產品，彩色濾光片為0.30 ~ 0.73公斤VOC/公斤產品，冷陰極燈管為0.16公斤VOC/公斤產品，有機發光二極體平面顯示器為0.0924公斤VOC/公斤產品，導光板0.00143公斤VOC/公斤產品。 2家半導體業使用排放VOC特徵成份至少21種，其中丙酮占44.4％、PGMEA 23.7％、N-甲基四氫砒咯酮 11.9％、異丙醇IPA 5.0％及TMAH 4.4％， 5種物料共佔89.4 ％，其它16種僅佔10.6％，其中HAPs成份有二甲苯、二氯乙烯及醋酸丁酯等3種。2家半導體業生產晶片之VOC總排放係數為0.0408VOC/公斤產品，生產晶圓則為0.544公斤VOC/公斤產品。 3家印刷電路板廠使用排放VOC特徵成份包括至少8種，其中乙醇占58.4％、二甲基甲醯胺16.0％、甲基吡喀烷酮10.7％、異丙醇5.8％及乙酸乙酯5.6％等5種共佔96.5％為最多，而二甲基甲醯胺屬於HAPs成份。3家印刷電路板廠生產AG抗眩膜、HC硬化膜及保護膜之VOC總排放係數為1.0公斤VOC/公斤產品，軟性銅箔基層板、保護膠片為0.21 ~ 0.27公斤VOC/公斤產品公斤，銅箔基板為0.08 ~ 0.17 公斤VOC/公斤產品。 3家漆包線之電線電纜業排放VOC成份為甲酚30.1％、酚30％及二甲苯39.9％，3種均屬於HAPs成份，3家漆包線之電線電纜業VOC總排放係數為0.041 ~ 0.062公斤VOC/公斤產品。 比較質量平衡法與檢測法之揮發性有機物排放量差異顯示，半導體 B廠之檢測法VOC排放量比質量平衡法估算量少34.5％；光電G廠則少了65.3％。光電G廠另以環保署公告之排放係數0.18（kg/m2液晶）估算其 VOC排放量，VOC年排放量為11.88噸/年，比質量平衡法及檢測法所得之VOC值多達40.0％及79.2％。
並列摘要
The purposes of this study was to search the characteristics of VOC emission from photoelectric semiconductor and relative electrical industries (including general and toxic components of VOCs, emission coefficient and mass), and to compare the difference among the mass balance method, the investigation method and the emission coefficient for estimating the VOCs emission mass, or so to discuss the serviceability of three methods. There were at least 25 kinds characteristic components of VOC emission from 6 photoelectric manufacture plants, and 88.4% of the all emission mass including IPA (27.6 %), BDG (24.9 %), MEA (21.6 %), ethyldiol (9.6 %) and DMSO (4.7 %) were the five major components, the other 20 components were the minor components which contained four hazardous air pollutants as Toluene, xylene, dichloromethane and butylacetate. Total VOCs emission coefficient in the 6 photoelectric manufacture plants were 1.03 kg VOC/kg products for color filter + TFT-LCD display, 0.30 ~ 0.73 kg VOC/kg products for color filter, 0.16 kg VOC/kg products for cool cathode lamp, 0.0924 kg VOC/kg products for organic fluorescent dipole display and 0.00143 kg VOC/kg products for photoconductor plate. There were at least 21 kinds characteristic components of VOC emission from 2 semiconductor manufacture plants, and 89.4% of the all emission mass including acetone (44.4 %), PGMEA (23.7 %), NMP (11.9%), IPA (5.0%) and TMAH (4.4 %) were the five major components, the other 16 components were the minor components which contained three hazardous air pollutants as xylene, dichloroethylene and butylacetate. Total VOCs emission coefficient in the 2 photoelectric manufacture plants were 0.0408 kg VOC/kg products for wafer plate, 0.544 kg VOC/kg products for wafer. There were 3 kinds of characteristic components of VOC emission from 3 electric wire (Enamel-insulated wire) manufacture plants, which included cresols (30.1 %), phenol (30.0 %) and xylene (39.9 %) that were all belong to HAPs. Total VOCs emission coefficient in the 3 electric wire (Enamel-insulated wire) manufacture plants were 0.041 ~ 0.062 kg VOC/kg products for electric line. Comparisons of the difference between the estimation of VOC emission mass using mass balance method and investigation method exhibited that the investigation method obtained 34.5 % of VOC emission mass less than that using mass balance method in the case of semiconductor plant B, while 65.3 % less in the case of photoelectric plant G. The emission coefficient method was also used to estimate the VOC emission mass from photoelectric plant G with the public emission coefficient 0.18 (kg/m2 LCD) from Taiwan EPA, which obtained the emission mass of 11.9 ton/year that had the difference percentage of 40.0 % and 79.2 % larger than that using mass balance method and investigation method.