LED用散熱封裝塗料之研究

電子產品不斷地更新，整個產品外觀除了往輕、薄、短、小設計的趨勢外，其功能性也往高功能、高傳輸、高效率的方向開發。因此，熱管理技術在整個產品設計過程中的重要性與日遽增。在特定產品應用上及熱管理設計程序之元件整合部分中，最重要也是關鍵的步驟是選擇最適化之熱界面材料，以提昇整體電子產品之散熱效能。本研究透過機能性樹脂分子結構設計與改質、硬化起始劑之篩選及導熱粉體添加/機能化改質，製備了具低收縮、高散熱、高接著等特性之反應性高分子機能複材。此外，我們亦搭配功能性配方設計、分散及硬化速率調控等技術，開發出表面阻抗1×109Ω/□~1010Ω/□、熱傳導係數11.36 W/m.K、接著強度19.45 kgf/cm2、收縮率1.71 ％之散熱塗料，以建立國內光電/電子產業用高附加價值關鍵材料之自主化能力，並提昇國際市場的競爭力。

關鍵字

熱界面材料；散熱；熱傳導係數；塗料

並列摘要

As electronic products constantly renovate, the appearance of the products trends to be light, thin, short, as well as small and their functions also direct to high applications, high communication, and high efficiencies. Therefore, the technology for thermal management in the whole process of product design is persistently important. For the applications of specific products, the pivotal step for device integration of thermal management design is the selection of optimal thermal interface material, promoting the heat-dissipating efficiencies of whole electronic products. In this study, reactive functional hybrid polymers with low contraction, high thermal dissipation, and high adhesion have been prepared by molecular structure design/modification of functional resins, prescription of initiators, and addition/modification of heat-dissipating powders. With the technology for functional prescription design, dispersion, and manipulation of curing speed, furthermore, we have also successfully manufactured thermal dissipating paints with surface resistance 1×109Ω/□~1010Ω/□, thermal conduction constant 11.36W/m.K, adhesion strength 19.45 kgf/cm2, and contraction rate 1.71％, establishing the self-research capabilities of key materials with high added value for domestic optoelectronic/electronic industries and enhancing the competitiveness for international markets.