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  • 學位論文

電子產品可靠度企劃與植入設計之研究

The Study of Design for Reliability on the Reliability Planning and Preliminary Design of the Electronic Product

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摘要


近年來,國內各大廠對可靠工程之相關活動相當熱衷,唯仍僅限於產品/零組件之可靠度測試階段,或者簡單之產品/零組件可靠度預估分析,而缺乏真正將產品可靠度與維護度設計流程導入產品之研發過程。因此,本研究將提出一套完整的「可靠度植入設計整合流程」,針對某些企業於產品之研發設計初步階段,產品可靠度已達到或未達到顧客要求時,如何運用可靠度的分析及設計方法來改善及提升產品的可靠度。 研究中,首先將運用商用Bellcore 標準初估產品的可靠度,與顧客需求做比較,當產品預估的可靠度無法達到顧客要求時,利用ARINC可靠度配當法,將目標可靠度分配至各分系統及功能模組,之後進行修正因子影響分析,調整電性應力、品質等級、溫度等修正因子,以了解各別的變化對失效率的影響程度及趨勢,提供後續相關設計(如減額定設計)之參考依據,以期能達成提升產品可靠度之目的。另外,若產品預估的可靠度已達到顧客要求時,仍可運用上述之應力因子影響分析分析來達成改善產品可靠度之目的。 最後,本研究將以穩壓器產品作為實例分析,說明如何運用本研究所提出之流程及方法進行提升/改善產品可靠度。藉由此實例研究得以印證本文所提之「可靠度植入設計整合流程」之可行性,可供相關人員於產品開發期間之可靠度企劃的參考擇優,並於初步設計階段掌握系統的可靠度特性,如此將可提供企業採取有效的行動,提升/改善產品可靠度,縮短產品研發時程。相信本研究之成果對業界進行可靠度工程實務上有極大的幫助。

關鍵字

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並列摘要


In recent years, many large domestic factories is interested in the activities of reliability engineering. But, the reliability testing and/or simple reliability prediction of the products and/or components are only applied to the product development, as for the reliability integration of the product development, the integrated process of the design for reliability are limited. In this paper, the integrated process of the Design for Reliability will be proposed to the application of the conceptual and preliminary design phases of the product development. The aim of the proposed integrated process is to improve or promote the product reliability level. In the proposed integrated process of the design for reliability, firstly, the comparison of the reliability level between the customer’s need and the results of the reliability prediction analized by t he RELEX Bellcore database will be performed in the proposed process. In the case of the prediction of the product reliability is unable to reach customers demand, The ARINC method will be adopted to distribute the product reliability target into the product hierarchy classified as subsystem, modules, and component unit. For improving and/or promoting the product reliability level, the quantitative analysis of the fault tree analysis and reliability prediction will be performed to the failure modes for finding the critical failure modules or component units. Furthermore, the sensitivity of the product reliability subjected to the design parameters such as the corresponding electric stresses, quality levels, and temperature will be investigated by the parametric analysis. The results of the parametric analysis can be referred to the derating design for improving and/or promoting the product reliability level. For demonstrating the feasibility of the proposed integrated process of design for reliability, the power stabilizer with the continuous compensation on the conceptual and preliminary design phases of the product development will be adopted to the application. It can be believed that the application of the proposed process can give strong impetus to improve the competition of the co-operative enterprise and advance the ability of the reliability design

並列關鍵字

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參考文獻


[15]廖大偉;「Bellcore預估技術的導入與應用」;皮托科技股份有限公司。
[11]Cluj-Napoca;Applications of Stress Derating and Thermal Analysis to Improve the Reliability of Electronic Modules.
[12]Wen-Chang Kang;A Critique of Mil-Hdbk-217E Reliability Prediction Methods.
[1]柯耀輝;「可靠度保證-工程與管理技術之應用」;中華民國品質學會;台北;民國93年2月。
[2]王宗華;「可靠度工程技術手冊」;中華民國品質學會;台北;民國89年2月。

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