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  • 學位論文

利用TE cooler製作恆溫控制裝置

Using TE Cooler on Device of Thermostatic Control Unit

指導教授 : 謝振榆
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摘要


從大陸的黑心食品到台灣近期一連串的問題食品,讓食品安全再度受到重視,民眾開始覺得外食的風險遠高於家裡準備的便當 ! 台灣夏季氣候炎熱,食物如未經冷藏處理極易腐敗,為了讓中午時分,每個人都能吃到家人愛心準備的熱騰騰便當。   所以我們研究動機就是將便當袋能同時擁有冰箱冷藏與蒸飯機加熱功能,讓放置其中的溫情便當能夠冷藏(4℃以下)不會餿掉(藉由隔熱材料的實驗與選用,現在的冷藏溫度可降至1.8 ℃),食用前加熱至自己最合適的溫度(恆溫控制) ! 讓人吃在口裡暖在心底。   本文內創作系使用熱電致冷片(Thermoelectric Cooler Chip),其晶片擁有兩種特性,即晶片兩端可快速的降溫以及升溫,利用該特性來進行冷藏與加溫需求,並藉由運用隔熱材的選擇與一組恆溫控制模組之設計來達到此次研究所需目的。

關鍵字

熱電致冷片

並列摘要


Food Safety has gained renewed attention as a public concern relates to a series of food safety issues that arise one after another, such as the contaminated food from Mainland China and Taiwan. People began to think that the risk of eating out would be much higher than eating a boxed meal. In Taiwan’s hot summer , foods without cold treatment are highly perishable. Also , we hope that people can enjoy the families’ lovingly prepared boxed lunch.   Our researching motivation is to develop a kind of bag which can refrigerate and steam the meal box. The meal box in the bag can be chilled (4 ℃) to avoid the food spoiled and heating the food at the most appropriate temperature for eating (Thermo statical Control)( By doing experiments and choosing heat insulation material. Now, the temperature can be chilled 1.8℃) Finally , people can feel the warm in their hearts while eating foods.   Thermoelectric Cooler Chip , which has two kinds of characteristics, is used in the invention of this article , namely , the both ends of the chip can be quickly cool down and heated to fulfill the refrigerated and heating needs and achieve the purpose of this study by choosing heat insulation materials and designing a set of Thermostatic control module.

並列關鍵字

Thermoelectric Cooling Chip

參考文獻


[21]潘建文,2013,”屋頂溫差發電降溫裝置系統”,國立虎尾科技大學光電與材料科技研究所碩士論文.
[24]胡原麟,2013,“致冷晶片在冷熱風扇之應用”, 國立虎尾科技大學光電與材料科技研究所碩士論文.
[26]吳明璋,2006,”散熱座結合熱電致冷器之最佳化設計”, 國立清華大學動力機械工程學系博士論文.
[3]R.E. Simons and R.C. Chu, Application of Thermoelectric Cooling to Electronic Equipment : A Review and Analysis,Sixteenth IEEE SEMI - THERM Symposium , 2000 ,pp 1 - 9.
[6]D.D.L Chung,Composites Get Smart,Material Today, Vol,5,2002,pp.30-35

被引用紀錄


黃源億(2016)。致冷晶片商品化特性研究〔碩士論文,國立虎尾科技大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0028-2507201619155400

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