以全球產業地位來說,台灣IC設計業排名世界第二,僅次於美國,但由於中國發展本土半導體產業,且政策多以超越台灣半導體各項產業為主,對台灣的威脅日益增加;而全球資通產品的中心移往中國大陸,半導體產業也更往中國傾斜,以及政策及內需市場的帶動下,中國半導體產業之發展指日可待。就IC設計而言,中國自有品牌的崛起,以及向上整合的方式,使得中國IC設計獲得相當大的挹注,對台灣IC設計產業的競爭壓力逐漸增加。 雖然台灣IC設計產業的處境日益艱難,手機晶片的成長漸漸趨緩,但新的技術與新的應用的出現,將帶動了下一波的需求,於此,能否在新的一波的浪潮下成長將是決定IC設計公司存活的關鍵。本研究目的在提供IC設計產業廠商評估生產階段及市場階段的效率,並對於無效率廠商提供改善的建議,以期能提升相關的效率,進而帶動產業的進步與成長。研究採用動態網路資料包絡分析法(Dynamic Network DEA)評估並分析台灣上市之IC設計公司2011年至2015年之效率與生產力,剃除資料缺遺或已消失之廠商,共得26家廠商,並利用魏克森等級和檢定(Wilcoxon Rank Sum Test)來檢定所得之資料,或可提供廠商及資本市場的參考。
By global industry position, the Taiwan IC design industry ranked second in the world, behind the United States. But due to the development of Chinese semiconductor industry, and most policies aim to exceed the tops of Taiwan semiconductor industries, Taiwan’s threat is increasing. The global information and communication centre is moved to the China. And China's semiconductor industry driven by policies and the domestic market will be more grown up. Although Taiwan's IC design industry is in a difficult situation, and the growth of mobile phone is slowing, the new technology and new applications, like VR, wearable device, smart home, etc. will drive the next demand. It is the key that rise the efficiency and productivity to catch the next wave. The aims of this study will help and give suggestion to the companies that have no efficiency to improve. We illustrate an innovative way of using Dynamic Network Data Envelopment Analysis (DNDEA) to create a composite measure of Taiwan's IC design industry. The actual data is gathered in five periods from 2011 to 2015 from the Taiwan Economic Journal (TEJ+) and got 26 companies for this study. We also use the Wilcoxon Rank Sum Test to test data to provide reference for companies and capital markets.