透過您的圖書館登入
IP:18.118.200.197
  • 學位論文

整合式高功率遮光件設計參數分析與實作

The Modeling and Implementation for Integrated Shutter Adapter used in High Power Laser System.

指導教授 : 林依恩
若您是本文的作者,可授權文章由華藝線上圖書館中協助推廣。

摘要


在光纖通訊的傳輸上,為了能使不同的設備和系統相連接,需要一個靈活的連接器成就光纖與光纖資訊之間的傳送與接收,讓光訊號能按所需的閘道進行資料的運輸,而這個器件就稱為連接器(適配器)。光纖之所以會被廣泛的應用作為信號傳遞媒介其特點為保密性、低損耗、高頻寬、長距離、高傳輸速率等。為了拉長傳送訊號,資料的距離無需中繼點,因而使用高功率二極體發射雷射光到光纖。但人的眼睛無法感受到雷射光;此遮光器的功能為避免光纖通訊系統中的雷射光源傷害人類的眼睛,造成人眼暴露於雷射光中不自知而產生工安意外災害。研究目的在探討光纖轉接器中的金屬彈片光遮斷效果,是否能完全阻擋封鎖對眼睛有害的雷射光。   本研究以「彈-塑性」理論結合參數設計探討高功率遮光件對初始回彈量的影響。本文使用有限元素分析軟體MSC.Marc做分析模擬,藉由不同的金屬遮光器彈片模型角度、厚度、溫度等條件因素去探討若改變此遮光器的控制因素對整個光纖連接器和跳接線之間單模、雙模重新組態互換重覆插拔後是否很快的產生塑性變形,失去遮光的功能性。其實驗和模擬結果,可做為遮光器本體組件在機構零件設計和可靠度結構分析上的參考。

關鍵字

應力分析 回彈 高功率雷射

並列摘要


The light of a laser beam used for optical transmission in high-power applications can damage the eyes of an individual that installs the optical fiber connection. A fiber adapter with a shutter member is therefore beneficial to provide a laser blocking. In this paper, a novel shutter member is clipped on the protrusions on the inner walls of the adapter by a clipper. A shutter plate extends into the receiving room of the adapter so as to block intensive light harmful to eyes. The finite element modeling was used to study the construction of the integrated shutter. Applying the geometric nonlinear feature and the experimentally obtained shutter properties in the program, we are able to study the effects of packing parameters on the shutter spring back. The proposed design can provide rigid design to harsh environment and reliable construction after mating test.   In this study, elastic-plastic material properties were considered in the simulation. The simulation results can be used in commercial product design.

並列關鍵字

stress analysis spring-back high power laser

參考文獻


[10]柯盛夫,「板件彎曲成形回彈機制之研究」,國立臺灣大學機械工程研究所碩士論文,2004
[14]陳銘輝,「SMT彈片應力分析及最佳化設計」,國立高雄應用科技大學模具工程系,2010
[20]滿梓芸,「超薄板料連續沖彎成形分析與模具設計」,國立虎尾科技大學,創意工程與精密科技研究所碩士論文,2008
[22]洪世豪,「MT-RJ型光纖連接器之套管製程最佳化分析」,中原大學機械工程學系,2003
[11]Pang, J. H. L., Chong, D. Y. R., and Low, T. H., ‘‘Thermal Cycling Analysis of Flip-Chip Solder Joint Reliability’’, IEEE Trans. Compon., Packag. Manuf. Technol., 24(4), pp. 705–712,2001.

延伸閱讀