應用修正式德菲法和層級分析法於IC封測委外供應商評選模式之研究-以射頻晶片業為例

Application of MDM and AHP method in Outsourcing Selection Mode for Assembly and Testing－A case study of RF IC

羅惠嫺(Hui-Hsien Lo)

指導教授 ： 洪士林

國立交通大學/工學院/工學院工程技術與管理學程/碩士(2018年)

摘要

本論文運用了修正式德菲法及層級分析法探討封測供應商評選模式，將修正式德菲法(MDM)做為評選因素準則之篩選使用，再利用層級分析法來找出射頻晶片公司委外評選廠商之關鍵的因子。分析結果與先前修正式德菲法專家訪談資料之統計數據做比較一致性。根據層級分析法(AHP)權重分析的結果，發現價格成本並不是專家考量的最主要準則構面，反而是「品質控管能力層面」為此領域專家們所重視的主要準則構面；所以，爾後在做射頻晶片封測委外選擇時，應該以這個結果來做為首位評選之準則。再則，次要準則因素整體權重排序結果，排名出在前六項的重要因素中，專家們一致認為「代工廠需具備出貨交期準時能力」為整體次要準則中最重要的因素，「代工廠需具備實驗數據解析能力」因素為次之，接續為「代工廠需具備ESD防護」、「代工廠生產良率高低」、「代工廠需具備RMA處理能力」、「代工廠需具備產品異常處理能力」品質控管能力層面就佔有三項。

關鍵字

射頻 ； 外包評選 ； 封裝測試 ； 德菲法 ； 層級分析法

並列摘要

In this work, the Modified Delphi Method (MDM) and Analytic Hierarchy Process (AHP) methods are employed to explore the supplier selection model of the packaging and testing suppliers for the RF chip company. The MDM is utilized as the screening criteria for the selection criteria (key), and then the AHP is used to identify the key factors for the selection of vendors for the RF chip company. The results reveal that the analytical outcomes are consistent with the statistics of the previously revised MDM expert interview data. Regarding the results of the weight analysis of the method of AHP, it is found that the price cost is not the most important criterion aspect of the expert consideration, but the quality control capability of OEM is the central criterion that experts pay attention to. Hence, the capability of quality control should be the primary criterion for selection an RF chip packaging and testing outsourcing. Furthermore, the work identifies and ranks six important factors in the secondary criteria factors. Among the top six secondary criteria, the OEM factory needs to have the delivery punctuality is the most main factor. The capability of data analysis for the foundry is the second important aspect. Subsequent factors are: requires ESD protection for the foundry, the quality of production yield of the foundry, requires RMA processing capability for the foundry, and required for the foundry having the capability for handling product's abnormal processing. Among them, three aspects are related to the quality control capability of OEM.

並列關鍵字

RF ； outsourcing ； assembly&testing ； Modified Delphi Method ； Analytic Hierarchy Process

參考文獻

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