半導體廠年度歲修期間風險管理之研究~以E公司為例

Risk Management for Semiconductor Factory Annual Maintenance Period -A Case Study of E Corporation

陳偉民(Wei-Min Chen)

指導教授 ： 陳春盛

國立交通大學/工學院/工學院碩士在職專班產業安全與防災組/碩士(2008年)

https://doi.org/10.6842/NCTU.2008.00025

摘要

摘要
半導體廠是屬於高產值也是高風險的產業，也正因如此，必須透過24小時運轉生產才能提高其經濟效益，但是機器設備長期使用下來除了平常例行性的維護保養之外，往往需配合每年台電歲修期間好好的進行相關廠務設施歲修保養工程，以維持機器設備的效能，甚至有些原本預計要改善的工程或是新增設的設備機台，也都會配合利用此一時間來進行作業。因此可知許多的工程都要在短期間內完成作業；然而廠區內通常僅剩下發電機所供應的緊急電源，這些電源絕大部分也都會用在維持無塵室的空調系統以確保其潔淨度及溫溼度能保持正常，所以緊急電源也只供應部分的照明；而使廠區內環境會比平常昏暗，再加上同時間內廠區會進行許多特殊危險性作業的工程例如：高架作業、吊掛作業、氣體化學品管路拆除作業、危險性機械設備作
業、動火作業、侷限空間等特殊作業，由此可知在年度歲修期間的風險極高，值得深入去研究如何順利的將所有工程逐項的在安全的狀態下完成。

本論文是研究如何在半導體廠年度歲修作業期間做好有效的風險管理，透過風險管理機制有效達到降低意外事故的發生和避免人員傷亡以及財產的損失，並透過E公司的案例來找出日後還可進一步改善的地方，並提出可行性的改善策略，期望藉此研究提供日後半導體廠歲修時參考。

關鍵字

半導體 ； 歲修 ； 風險管理

並列摘要

Abstract
Semiconductor manufacturing fab is classified as the industry that can not only yield higher output value but also has higher risk. Therefore, it has to adopt the process of 24-hour operation and production to upgrade its economic efficiency; however, except for regular and routine maintenance, the machinery equipment, after long-term use, has frequently been cooperated with Taipower Company’s schedule of annual maintenance to conduct and implement the annual reaping and maintenance construction for related fab facilities in order to preserve the efficiency for the machinery equipment. Even for those engineering projects that were expected to be improved or additional equipment and machine, they will also cooperate with such period to implement related operations. Thus, we knew that many engineering projects need to be completed in a short period of time; however, there is only emergency power remained in fab area that supplied by generator in general, and the majority of such electric power will be used to keep the operation of air-conditioning system in order to ensure of normal cleanness, temperature and humidity for the clean room; therefore, the emergency power can only be supplied partial lighting. As a result, it may cause fab area to become more dim than usual; meanwhile, many constructions with specifically hazardous operations may carry out in fab area, such as: high-elevation operation, hanging operation, dismantling operation of gaseous chemical piping, hazardous machinery equipment operation, fire operation, and confined space operation, etc.; therefore, it can be seen that high risk has existed in the period of annual maintenance, and it is an important issue that worthy to conduct in-depth research on how smoothly complete all constructions one by one under safe working condition.

This study is mainly focused on how to implement effective risk management during the annual maintenance period for semiconductor fabs; in addition, through the mechanism of risk management to effectively reduce the occurrence of accident and avoid personnel injury and property loss as well. This study has also adopted a case study of E Company to sort out those parts that can be further improved, and has proposed some improving strategies of feasibility in order to provide as a reference to implement the annual maintenance for semiconductor fabs in the future.

並列關鍵字

Semiconductor ； annual maintenance ； risk management

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