暫時性接著技術中聚亞醯胺基板與玻璃載板間離形能力之探討

Temporary Bonding Technology: Investigation on The Interfacial Releasing Ability between Polyimide Substrate and Glass Carrier

李志宗(Chih-Tsung Lee)

指導教授 ： 呂志鵬

國立交通大學/工學院/平面顯示技術碩士學位學程/碩士(2016年)

摘要

軟性電子元件的生產方法可分為卷對卷與片對片兩大類，其中片對片的生產方式生產軟性元件需要應用到的是暫時性接著技術，該技術在元件製作過程中軟性基板附著在硬質載板上，並在元件製程結束後將軟性基板與硬質載板分離。

近幾十年來，暫時性接著技術不斷被開發與研究，聚亞醯胺基板與玻璃載板的組合常被利用在需要高溫的製程中，主要因為聚亞醯胺是最耐溫的工程塑膠，而玻璃是最普遍的硬質載板。聚亞醯胺與玻璃的離形方式常見有雷射分離法、膠合減黏法、機械力離形法等，而機械力離形法是所有方法當中成本最低、產能最高、污染最少的方法。機械力離形法可在聚亞醯胺與玻璃製作一層幫助分離的中間層或將聚亞醯胺直接在玻璃上塗布成膜。無中間層的方式是機械力離形法中成本最低的方式，然而沒有中間層的情況下，離形的能力與離形的穩定性是該技術最大的問題，也導致該技術目前為止未被廣泛使用。本論文主要針對在未製作元件之前，聚亞醯胺基板與玻璃載板間本身是否就存在離形能力的問題進行探討，以不同的合成方式的聚亞醯胺材料及不同種類的玻璃進行研究;另外由於聚亞醯胺直接接觸於玻璃上，玻璃在製程的前處理是否會造成影響也是研究的重點之一。

研究結果發現當玻璃表面風化層對離形有顯注的影響，當玻璃風化層被去除或是使用較不易風化的玻璃材質時，會導致原本容易離形的聚亞醯胺材料變成離形困難。風化層相當於自然形成的離形層，利用容易風化的玻璃有助於該技術的良率提升以及保有良好的離形穩定性，在不需要另外建構設備製作離形層或分離層的情況下，達到聚亞醯胺基板與玻璃載板最後分離的目的。

關鍵字

聚亞醯胺 ； 玻璃 ； 暫時性接著技術, ； 離形能力 ； 風化

並列摘要

The production methods of flexible electronic can be divided into two categories,roll to roll (R2R) and sheet to sheet (S2S). In the S2S Industry, fabricating the flexible electronic needed to be applied by temporary bonding technology. In the process of fabricating the flexible electronic, flexible substrate was attached onto the rigid carrier. Finally, the flexible substrate separated from the rigid carrier.

In recent decades, the temporary bonding technology continue to be developed and research. Wherein polyimide substrate and glass carrier were the most popular in high temperature Fabrication, mainly due to polyimide is the most temperature resistant engineering plastic and the glass is the most common rigid carrier. Separating polyimide substrate and glass carrier were including laser separation method, glue sticking reducing method, and the mechanical force releasing method. The mechanical force releasing method was among the lowest cost, the highest capacity, and the least polluting method. This method could be divide into "deposited de-bonding layer" and "directly coating". No intermediate layer, “directly coating”, of mechanical force releasing method was the lowest-cost way. However, the absence of an intermediate layer, the releasing ability and releasing stability of the technology is the biggest problem, but also led the technology so far had not been widely used. The aims of this paper were researching the issues of polyimide substrate and glass carrier by different synthesis methods polyimide and different types of glass; In addition, polyimide in direct contact with the glass surface, so we also focus on the effect of glass surface treatment.

The study found that when the glass weathered layer had been removed or usage of unweathered glass, it would lead to the original easily releasing of polyimide into difficult releasing. Weathered layer corresponds to the natural separated layer. The weathered glass enhanced the yield and to maintain a good releasing stability.

並列關鍵字

Polyimide ； Glass ； Temporary bonding technology ； Releasing ability ； Weathering

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