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摘要


工廠自動化(FA)是近幾年熱烈討論的話題, 資訊產品除了在製造過程自動化外, 產品的電氣測試也是自動化中相當重要的一環, 本篇論文針對目前資訊產業之電氣測試自動化遇到的瓶頸加以分析後, 研究如何開發軟硬體工程並設計導入之方式. 此全新的測試流程是真正的學以致用實際應用於目前的資訊產品產業中. 其中開發項目分為三大方向: 電子工程開發; 軟體工程開發; 機構工程開發. 更針對顯示介面的"水波紋"不良檢測做了研究及實驗. 最後更針對這些新工程方式導入後讓資訊產業確實在成本不需大幅增加的前提上, 讓產能及品質實質的大幅提昇.

並列摘要


Factory Automation (FA) is a hot topic in recent years, the 3C product in FA topic is not only focus on manufacture flow but also need to focus on functional test flow. This thesis focuses on the functional test of 3C product, and the 1st step is to analysis the bottle neck of test-flow, after that, how to develop hardware software even mechanical architecture is thesis’s point. This new testing process is truly apply what we learn in the academy, and implement to the factory. The development items in the thesis is divided into three important part : EE(Electronic Engineering); SE(Software Engineering); ME(Mechanical Engineering). And the “Water Ripple”(which is really hard to detect) is also been discussed how the phenomenon appears in the monitor and how to detect defeat product. In the final chapter, we also estimate the benefits after implement. And we really see the quality and yields are increased but cost.

並列關鍵字

PCBA Funtional test FA Mother Board Water Ripple

參考文獻


[8] LVDS user manual 4th edition on national.com/CHS/lvds 2008
[13] Papoulis Pillai, “Probability, Random Variables and Stochastic Processes” Chapter 7, 2002, ISBN 978-0-07-112256-6, MHID 0-07-112256-7
[14] SC.kuo “MFC Visual Studio 2005” 2006. ISBN 986-125-787-X
[1] John Guy , EE Times-Asia “Tap AC-coupling for LVDS signals” January 1-15, 2008
[2] Weng & Chris & Hsinchao “PCIe Gen.2 Physical Layer Analog Front End” SoC Technical Journal 005

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