無電解銅電鍍液的安定劑與配位劑成份分析及鍍液穩定性研究

The Constituents Analysis and Stability Study of Stability Agents and Complexing Agent of Electroless Copper Plating Solution

葉非凡(Fei-Fan Ye)

指導教授 ： 陳政男

朝陽科技大學/理工學院/應用化學系/碩士(2013年)

摘要

無電解電鍍（Electroless plating）為現今工業中常使用的一種電鍍方式，無電解電鍍銅技術可透過鍍液內的氧化還原反應將銅離子快速、均勻沉積到基體表面，對非金屬表面金屬化是一種非常有效的方法，且有電鍍過程不需在高溫和真空環境下操作的優點，使無電解電鍍銅液配方的組成為現今科學家研究的重點之一。其中無電解電鍍液配方內添加劑所使用量通常為每升幾毫克至幾十毫克，其含量在鍍液組成中是相當低的，但添加劑的使用對鍍液的穩定性與基材鍍層表面的性能卻有極大的影響。
本實驗主要使用電噴灑質譜儀(ESI-MS)、核磁共振光譜儀(NMR)、紅外光譜儀(IR)、紫外光可見光譜儀(UV/VIS)等常見分析儀器，對工業界使用的無電解電鍍銅液內添加的安定劑與配位劑成分進行定性與定量分析。經由上述等多種分析方法確認出工業界使用的無電解電鍍銅液的安定劑成分為硫氰化鈉(NaSCN)，濃度為1800 ppm; 配位劑EDTA-4Na溶液內含另一少量化合物成分分析結果為2,2-Bipyridine，其濃度為180 ppm。實驗最後則將分析結果的安定劑(NaSCN)與配位劑(EDTA-4Na、2,2-Bipyridine)所組成的無電解電鍍銅液進行電鍍試驗，確認鍍銅液的鍍液穩定性與鍍上銅鎳合金的基材鍍層性能表現皆較原始配方佳。

關鍵字

電噴灑質譜法 ； 無電解電鍍

並列摘要

Electroless plating is often used in industry as a plating method. In the electroless copper plating solution, copper will fast and homogeneously deposit on the surface of the substrate. This is an effective method for non-metallic surface metallization; moreover, it doesn’t need to work under high temperature and vacuum environment. Above advantages make the solution formulations of electroless plating become one of the interesting research points. The additives used in electroless plating solution are usually few milligrams to tenth milligrams per liter, however, they always play important roles for the stability of solution or improving the function of the coating layer on substrate surface.

In this paper, the identification and quantitative measurement of the stabilizer reagent and a complexing agent of an industry used electroless copper plating solution are studied by using electrospray ionization mass spectrometer (ESI-MS), NMR spectrometer, UV-VIS spectrophotometer and other common analytical instruments. The stabilizer is confirmed as sodium thiocyanate(NaSCN) with a concentration of 1800 ppm. Another complexing agent is identified as 2,2-bipyridine with a concentration of 180 ppm. Finally, these two components are applied in the electroless plating tests and give a better performance on both stability and coating properties on copper-nickel deposit substrate than the results obtained by original electroless plating formulation.

並列關鍵字

Electrospray Ionization mass spectrometry ； Electroless plating

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