埋入式被動元件整合於軟性電路板之研究

THE STUDY OF THE INTEGRATED PASSIVE COMPONENTS EMBEDDED INTO THE FLEXIBLE PRINTED CIRCUIT BOARD

王士豪(Shih-hao Wang)

指導教授 ： 簡昭珩

大同大學/工程學院/機械工程學系所/碩士(2005年)

摘要

隨著電子產品體積越來越小，使用之被動元件卻越來越多情況下，以埋入式被動元件取代分離式被動元件為一趨勢。在目前埋入式被動元件研究上多是對埋入於硬式基板之研究，而在軟式基板之埋入研究卻不多。本篇論文主要是提出利用微機電技術將電阻、電容、電感整合埋入於軟板基材中，以減少軟式基板面積之使用。
此次研究是以PI作為軟板基材，利用微機電技術把2個電阻、2個電容、2個電感埋入其中，埋入之被動元件是以西陵KT-663型無線電話電路板上之被動元件為範例。
於埋入被動元件後在10kHz下量測，電阻器之電阻值為1.171 、電容器之電容值為239.5pF、電感器之電感值為1.067 。與設計值相比較其誤差分別為電阻器17.1%，電容器8.86%，電感器6.7%。因此利用微機電製程將被動元件埋入於軟板基材中是為可行。

關鍵字

埋入式被動元件 ； 軟式基板

並列摘要

Based on the decreasing sizes of the electronic products, the distributed passive components could be replaced by the embedded passive components. The researches of the embedded passive components focus on the printed circuit board mostly to be presented except on the flexible printed circuit. Therefore, the passive components including resistances, capacitances and inductances are embedded into the flexible printed circuit by MEMS technologies to be presented in this study.
The polyimide is used to be as the flexible printed circuit. There are two resistances, two capacitances and two inductances to be integrated and embedded into flexible printed circuit. The specifications of the six passive components are form of the Kingtel KT-663 telephone.
In 10k Hz situation, the resistance of 1.171 , the capacitance of 239.5pF and inductance of 1.067 are measured. The difference of the resistance of 17.1%, the difference of the capacitance of 8.86% and the difference of the inductance of 6.7% are compared with the designing value. Therefore, the process is passable to embed the passive components into flexible printed circuit by MEMS technologies.

並列關鍵字

embedded passive components ； flexible printed circuit

參考文獻

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