田口法在準系統電腦散熱設計之應用

The Application of Taguchi Method in a Barebone Computer System Thermal Design

陳致偉(Chih-Wei Chen)

指導教授 ： 郭 鴻 森 ； 李 基 禎

大同大學/電機資訊學院/電機工程學系所/碩士(2006年)

摘要

中文摘要CHINESE ABSTRACT
由於電腦等級不斷的提升，發熱元件（如CPU、NB、SB、RAM）發熱瓦數也不斷的向上提升，其中以CPU瓦數達到100W左右，甚至於超過，對於電腦內部的散熱設計就顯得非常重要，對於體積小的準系統來說，散熱設計顯得更為困難。
本文使用模擬軟體配合田口實驗計畫法，針對CPU HEAT SINK方向（A）、增加風扇（B）、導流板效應（C）、風扇轉速（D）以及機殼開孔處及大小（E、F、G）等七大因子，做組合式模擬，以期找出對於系統散熱的重要因子，再組合出較佳的散熱設計，經田口實驗法分析後發現，對於CPU來說，CPU HEAT SINK方向（A）、風扇轉速（D）、導流板效應（C）有明顯影響；對於北橋晶片來說，CPU HEAT SINK(A)方向、導流板效應（C）與增加出風口（一）(F) 有明顯影響；對於南橋晶片來說，增加風扇（B）及增加出風口（一）（F）有明顯影響。
經由這些重要變因分析後，因此取case20(CPU HEAT SINK方向(A)、導流板效應（C）、風扇轉速(D))，當CPU輸出功率為98W，則熱阻值降低0.024 ，相當於CPU溫度降低2.4℃，並且南橋與北橋的溫度也可同時降低，此為較佳組合。再經由實驗驗證其模擬所得趨勢相符。

關鍵字

田口法、實驗設計

並列摘要

ABSTRACT
Due to constant upgrade of computers the power of heating elements such as CPU、NB、SB、RAM, inside also increase in watts. Among which, internal thermal load design for computer CPU is up to 100W or more, how to get proper thermal arrangement becomes extremely important. For small size barebone computer, thermal design is an even harder task to achieve.
The simulated software used in this thesis together with an experimental design based on the Taguchi Method have been integrated and used to simulate seven factors such as CPU HEAT SINK direction factor (factor A) within or without fan factor (factor B) baffle effect factor (factor C) Fan speed (factor D) cabinet tapping and size (factor E、factor F、factor G) to find important factors that contribute to heat dissipation of system and formulate its better thermal design. Refer to CPU, after applying Taguchi Method analysis , it has been found that three factors CPU HEAT SINK direction（factor A）、fan speed（factor D）、and baffle effect（factor C） show significant effects；Refer to north bridge chip, three factors CPU HEAT SINK direction (factor A) baffle effect（factor C）and added air outlet(1) (factor F) show significant effects；Refer to south bridge chip，two factors added fan(factor B) and increasing air outlet（1）（factor F） show significant effects.
After simulation analysis on these important factors, case20(CPU HEAT SINK)direction (A)、baffle effect（C）、and fan speed(D)) are attained; When CPU output power is 98W, then the heat resistance value is reduced by 0.024 , which is equivalent to 2.4℃ of temperature decrease for CPU . Meanwhile, south bridge and north bridge temperatures may also be decreased. This case is the better combination. The experimental results and simulated results are in conformity with each other.

並列關鍵字

Flotherm

參考文獻

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7.Kadir Bilen、Sinan Yapici and Cafer Celick, “A Taguchi approach for investigation of heat transfer from a surface equipped with rectangular blocks”,Energy Conversion and Management 42951-961,2001

12.Ko-Ta Chiang ”Optimization of the design parameters of parallel-Plain Fin heat sink module cooling phenomenon based on the Taguchi method”, International Communication in Heat and Mass Transfer 321193-1201,2005.

REFERENCES

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