雙工光次模組封裝技術研究

Bi-Directional Optical Sub-Assembly Technological Study

陳思銘(Szu-Ming Chen)

指導教授 ： 何明果

大同大學/工程學院/機械工程學系所/碩士(2006年)

摘要

本論文探討被動光網路架構使用之光收發器中,主要的光電轉換元件雙工光次模組的封裝技術,它是結合光學’機械’電子的設計領域,透過電子信號與光信號轉換,利用低傳輸損失的光纖網路來達成高速’遠距的信號傳輸需求,從光學設計的基礎與實際封裝的結果對照,可以反應出整體的設計搭配性,進而提供日後產品特性精進的方向。

關鍵字

光收發器 ； 雙工光次模組

並列摘要

In this dissertation, the packaging technology for Bi-directional Optical Sub-Assembly, which is the key component for the optical transceiver used in passive optical network, has been discussed. This technology is a combination of optical design, mechanical design and electrical design. Based on the converting between optical power and electrical signals, by utilizing the low loss optical fiber networks, high speed information exchange can be achieved over long distance. The suitableness of the design of the packaging technology has been confirmed by the comparison between the optical design and the actual packaging results. Guidance on how to improve performance of the product has been provided in this dissertation.

並列關鍵字

Optical Transceiver ； BOSA(Bi-directional optical sub-assembly)

參考文獻

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[30] Barry Elliott，Mike Gilmore，Fiber Optic Cabling，Butterworth-Heinemann，2001

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