添加聚四氟乙烯於無鉛SnO-MgO-P2O5玻璃中對其與低熱膨脹性元件接合性之影響

Influence of the addition of polytetrafluoroethylene (PTFE) into lead-free SnO-MgO-P2O5 (SMP) glass on the joining characteristics between the SMP glass and low thermal-expansion parts

蔡佩君(Pei-chun Tsai)

指導教授 ： 徐錦志

大同大學/工程學院/材料工程學系所/碩士(2007年)

摘要

SnO-MgO-P2O5(SMP)接合玻璃的高熱膨脹係數與低熱膨脹係數之玻璃基板(例如：Corning 1737® )相差很大，導致接合時產生明顯的熱應力，使兩者無法接合，甚至在接合降溫後SMP玻璃有裂痕產生。本實驗在SMP玻璃粉中添加聚四氟乙烯( PTFE )，希望其能吸收降溫過程中所產生之熱應力，以與低膨脹性的玻璃基板達良好之接合效果。
研究發現，當PTFE添加量為25%，燒結溫度由370到430℃，燒結體都可與上下基板接合。燒結溫度≧390℃時，界面出現連續之PTFE薄層，上方基板-燒結體界面處的PTFE層厚度約10-20μm，下方基板-燒結體界面處的PTFE層厚度會隨溫度上升而增加。添加50及75% PTFE之燒結體，燒結溫度由350到430℃，燒結體都可與上下基板接合。

關鍵字

聚四氟乙烯 ； 接合玻璃

並列摘要

There is a significant difference in coefficient of thermal expansion (CTE) between high-CTE SnO-MgO-P2O5 sealing glasses (SMP) and low-CTE substrates. As a result, they cannot be sealed to each other and it will even create cracks on SMP glasses during cooling after the sealing process. In this study, we expect that the above-mentioned thermal stress can be absorbed by adding polytetrafluoroethylene (PTFE) into the SMP glass powder.
It was found that, during the sintering process, PTFE will flow to the interfaces between the sintered body and the substrates. When the sintered bodies with 25 vol.% PTFE were sintered at 370 to 430℃, they can be sealed with the upper and lower substrates. When the sintering temperatures are higher than 390℃, the interface reveals a continuous PTFE layer. The thickness of PTFE layer which appears between the upper substrate and the sintered body is 10-20μm and that which appears between the lower substrate and the sintered body is increased with the increasing sintering temperature. The sintered bodies which contain 50-75 vol.% PTFE can be sealed with the upper-and-lower substrates at sintering temperatures from 350 to 430℃.

並列關鍵字

sealing glasses ； PTFE

參考文獻

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