添加聚四氟乙烯於無鉛SnO-MgO-P2O5 玻璃粉中改善其與低熱膨脹性元件的接合

Effects of addition of polytetrafluoroethylene (PTFE) into SnO-MgO-P2O5 (SMP) glass on the joining characteristics between SMP glass and low thermal-expansion parts

粘鳳卿(Fong-Ching Nian)

指導教授 ： 徐錦志

大同大學/工程學院/材料工程學系所/碩士(2008年)

摘要

將高熱膨脹係數之SnO-MgO-P2O5 (SMP) 接合玻璃與低熱膨脹係數之玻璃基板 (例如：Corning 1737○R) 接合時，因為兩者熱膨脹係數差異很大，導致接合時產生明顯的熱應力而無法接合。本實驗室曾在SMP玻璃粉中添加高分子─聚四氟乙烯 (PTFE)，藉以吸收降溫過程中所產生的熱應力，而與低熱膨脹性之玻璃基板接合。
當PTFE添加量為25%時，雖然能使SMP玻璃與低熱膨脹性玻璃基板接合，但是PTFE卻會在接合處與SMP燒結體周圍聚集成一薄層。本實驗藉由降低SMP玻璃粉末之粒徑，期望減少與PTFE粒徑之差距，而能使PTFE均勻分散於SMP燒結體中。並且討論不同氣氛下(Air、Ar)，對SMP-PTFE燒結體的影響。

關鍵字

錫鎂磷玻璃 ； 低熱膨脹係數

並列摘要

There is a significant difference in coefficient of thermal expansion (CTE) between high-CTE SnO-MgO-P2O5 sealing glass (SMP) and low-CTE substrates. As a result, they cannot be sealed to each other and it will even cracks on SMP glasses during cooling after the sealing process. In our early study, we had added polytetrafluoroethylene (PTFE) into the SMP glass powder to absorb the above-mentioned thermal stress.
It was found that, during the sintering process, PTFE will flow to the interfaces between the sintered body and the substrates. When the sintered bodies with 25 vol. % PTFE were sintered, they can be sealed with the upper and lower substrates. However the interface reveals a continuous PTFE layer.
In this study, we expect that the PTFE powder can disperse uniformly in SMP glass by diminishing the particle size of SMP glass powder to make it close to the PTFE powder particle size. And in this study, we discuss how the different atmosphere (Air、Ar) affects the SMP-PTFE sintered bodies.

並列關鍵字

low thermal expansion coefficient ； SMP glass

參考文獻

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[2] 蔡佩君，“添加聚四氟乙烯於無鉛SnO-MgO-P2O5玻璃中對其與低熱膨脹性元件接合性之影響”，大同大學材料工程研究所碩士論文(2007)。

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