界面活性劑濃度對無電鍍銅硫/EVA複合材料EMI性質影響之研究

Effect of Surfactant Concentration on EMI Shielding Effectiveness for the Electroless Copper Sulfide /EVA Nanocomposites

游振敬(Chen-Jing Yu)

指導教授 ： 黃繼遠

大同大學/工程學院/材料工程學系所/碩士(2008年)

摘要

在本實驗中，將不同濃度之溴化十六烷三甲基銨(CTAB)界面活性劑添加於無電鍍硫化銅鍍浴製程中以製備硫化銅粉末，再將硫化銅粉末添加於高分子基材（Ethylene-Vinyl Acetate, EVA）中進行混煉。使硫化銅為導電填充材充分混合在高分子基材中，在基材中形成導電網絡，以期此複合材料具有電磁波遮蔽效果(EMI SE)；在無電鍍硫化銅製程中加入陽離子界面活性劑溴化十六烷三甲基銨(CTAB)，利用介面活性劑分散、吸附及細化顆粒的特性，改變無電鍍的反應過程，使在電磁波遮蔽方面有良好的效果。 本論文研究不同濃度界面活性劑 (0.01M~0.09M)、不同填充硫化銅含量(50phr,100phr,150phr)、硫化銅結構及硫化銅顆粒大小對複材電磁波遮蔽效果之影響，再利用四點探針、XRD、FESEM、SEM、VNA和EMI SE分析及觀察添加不同界面活性劑濃度下，經由無電鍍所沉積的硫化銅粉末，其導電度、晶體結構、表面型態、生成顆粒大小及的效果及反應，並且對於電磁波遮蔽的影響。 在本研究中，未加入CTAB的無電鍍硫化銅粉末與基材混煉(100phr)之複合材料並無電磁波遮蔽效果，而添加0.03M的CTAB濃度下之無電鍍銅硫粉末，及100phr的填充比例加入基材中進行混煉所製成的導電性高分子複合材料，其電磁波遮蔽效果可達40dB以上，此因無電鍍硫化銅細化反應的發生，填充顆粒間距因硫化銅顆粒細化而縮短，使複材導電性增加，對於外來的電磁波容易形成感應電磁以反射遮蔽電磁波。

關鍵字

電磁波遮蔽 ； 無電鍍 ； 銅硫 ； 混練 ； 界面活性劑 ； 十六烷基三甲基溴化銨

並列摘要

In this study, the copper sulfide compound was produced by electroless copper method adding various concentrations of surfactant (Cetyltrimethylammonium bromide, CTAB). Then, copper sulfide was compounded with polymer material（Ethylene-Vinyl Acetate, EVA）. Because of the high conductivity of copper sulfide, the filler would interdicted the conductive network in the composites. This composite material could shield the electromagnetic wave. Since adding the cationic surfactant CTAB in the electroless Cu process, the effect of surfactant was separated, absorbed and attenuated on the copper sulfide in the electroless reaction.
The effect of various concentrations of surfactant(CTAB at 0.01M~0.09M), filler contents(50phr,100phr,150phr), the structure of copper sulfide and particle size of copper sulfide on the EMI SE of composites were investgated. The resistivity , structure, particle sizes and morphology of copper sulfide and EMI SE of polymeric composites analyzed by 4-point-probe method, XRD, FESEM, SEM, VNA and EMI measurement, respectively .
In this research, the composite with 100phr of copper sulfide content did not possess EMI SE as the copper sulfide did not contain CTAB. However, the composite possess EMI SE (40dB) as the 100phr of copper sulfide with adding 0.03M of CTAB was added. It was because that the finelized effect of electroless copper sulfide was occurred. The filler particle decreased the distance between copper sulfide particles. And then the conductivity of composite increased. The composite polymer could make the response electromagnetic against to reflection the electromagnetic wave from outside.

並列關鍵字

surfactant ； blending ； copper sulfide ； electroless plating ； EMI SE ； CTAB

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