Role of Surfactants in Codeposition of PTFE Particles with Electroless Ni-P Coating

界面活性劑在無電鍍Ni-P/PTFE複合鍍層共沈積之機構研究

葛明德(Ming-Der Ger) ； 黃炳照(Bing Joe Hwang)

《Journal of the Chinese Institute of Chemical Engineers》 32卷6期 (2001/11) Pp. 503-509

https://doi.org/10.6967/JCICE.200111.0503

摘要

本文針對FC-134及CTAB兩種陽離子型界面活性劑，分別探討其對PTFE微粒界面電位(Zeta potential)之影響及其在不同底材之陰極反應性，以說明界面活性劑在無電鍍Ni-P/PTFE複合鍍層共沈積過程中所扮演之角色。結果顯示在PTFE微粒共沈積過程中，不僅微粒之界面電位重要，同時界面活性劑之陰極反應性亦扮演重要之角色。本研究最後提出一個PTFE微粒共沈積之模式，來說明PTFE微粒之界面電位是主控沈積過程之弱吸附大小，而吸附在微粒表面之界面活性劑陰極反應性則決定強吸附之大小。

並列摘要

The role of surfactants in the codeposition of PTFE panicles with the electroless Ni-P plating was investigated in this study. The zeta potential of the surfactant-modified PTFE and the cathodic reactivity of the surfactants on the various substrates were measured. It was found that not only the zeta potential of the PTFE particles but also the cathodic reactivity of the surfactants play important role in the codeposition process. A model was also proposed to elucidate [he role of surfactants in the codeposition of PTFE with the electroless Ni-P plating. The zeta potential of the PTFE particles and the cathodic reactivity of the surfactants adsorbed on the PTFE particles dominate the weak adsorption and the strong adsorption in the codeposition process. Respectively.

並列關鍵字

Surfactants ； Reactivity ； Codeposition ； PTFE ； Electroless Ni-P mating