如何在有限的空間情況下,設計出最佳的散熱鰭片尺寸,使散熱座能達到最大效率的情況,處理元件上更高的熱量,同時一併考量到材料成本與重量,即為本研究的主要目的。 本研究是針對縱長型的散熱座,在已知鰭片數目、鰭片的寬度以及深度,來求出長方形鰭片的厚度及散熱鰭片的總體積。利用數值方法,用累加的計算方式,將每一鰭片表面的熱傳量與散熱座底座的熱傳量加總起來,可以求得整個散熱片的總散熱量。並透過無因次化參數的簡化,求得最佳化的數學方程式,並用程式計算,可求得最佳化的參數,再運用參數來求得散熱鰭片的最佳化尺寸,並可藉求得最佳化的尺寸來求出散熱效率,並且也將散熱座的熱阻值計算出來,做為將來設計上的參考因素。 而本研究中,使用計算的數據來自於市售的四款個人電腦中的中央處理器(CPU)所使用的散熱座,這些散熱座大多為了求保護中央處理器,所以大多都有做過最佳化設計或是因製造條件限制,將尺寸做出接近最佳化的數據,在對本研究的計算上,可以提供做為較為可靠的計算數據。 而在計算過程中,在不考慮鰭片頂端的散熱效果的情況下,在設計中,鰭片的深度與厚度比很大時,考慮是否忽略鰭片的厚度來簡化周長,對整個最佳化的計算結果並無明顯的影響,故實際計算時可以忽略不計。
As the development of the technology, there are more IC chipsets at the same size or smaller size package we used before. There is more heat and higher temperature should be solved. Engineer need to design an effective Heat Sink for most effectiveness in handling maximum heat dissipation under the limited space. The purpose of the study is focusing on the Longitudinal Rectangular Heat Sink, which knows the specific fin numbers, one side depth and width of the fin, for determination its thickness and volume. Using the equation of maximum heat dissipating determines the optimum value of the fin thickness then we can also know the optimum volume. During the computing process, we assume there is no influence from the Fin Tip Convection of the fin in this research. So, it could be ignored during the computation. According to the computing results, we can find the optimum thickness with different Heat Transistor Coefficient, and the thickness we computed has also the best effectiveness. So we can believe the method may be usable for the reference in the designing.