手持式工業電腦之散熱設計最佳化

本論文針對手持式工業電腦之散熱設計最佳化進行模擬分析。首先介紹工業電腦之發展與應用，進而深入探討電腦內部主機板上之發熱源，並針對其內的發熱元件設計散熱模組 (Heat sink)，經由散熱模組將主機板所產生的廢熱導出。在模擬分析中，將散熱模組及電腦後殼之開孔率納入分析參數中。本文使用散熱模擬軟體Flotherm進行模擬分析。研究中，在建構的3D模型及外殼的參數中，定義四個控制因子：Heat sink之base厚度(T)、總長度(L)、鰭片數量(N)以及外殼之開孔率(O)，依據田口實驗法對參數取三個Level採用L9直交表的參數組合進行模擬分析，而得到此四個參數之最佳參數組合。研究中以所得到的最佳參數組合進行實機製作，並比對模擬結果與實機測試所得之資料，結果顯示模擬分析所得之散熱能力，因受到其他未考慮因素的干擾而有些許誤差，但仍在可接受的上限規格範圍內。

關鍵字

散熱設計最佳化

並列摘要

This thesis is base on analysis of heat sink design on handheld industrial computer. Starts off with brief introducing of industrial computer's development and application and go on with discussion of heat dispensing and heat source on the motherboard then finally wrapping up with detail discussion on heat sink design . Thesis will go into detail on how variable and factors are used to come out with best heat sink design. Flotherm is the thermal analysis software application used in this study . In order to conduct the research, 4 control parameters are used: thickness of Heat sink (T), total length (L), number of cooling plates (N), and aperture on the housing (O). Taking Taguchi's Methods by calculating those parameters and came out with 3 different levels using L9 Orthogonal Array parameter combination for this simulation analysis, the best combination of 4 parameters can be chosen. The best combination parameters from the result of thermal analysis are used for actual design of the heat sink. A comparison test was done to compare the actual test result and the result from the thermal simulation. The finding was that the thermal analysis result was slightly off due to few of inconsiderable factors influencing the test result, but within a reasonable range.