中間電漿處理與氫氣含量對類鑽碳膜 機械性質與耐磨耗特性之影響

Effects of intermediate plasma treatment and hydrogen content on mechanical properties and wear behavior of diamond-like carbon films

胡宇光(Yu-Guang Hu)

指導教授 ： 曾信雄

大同大學/工程學院/材料工程學系所/碩士(2010年)

摘要

本實驗以固定比例甲烷混合氫氣，使用射頻電漿輔助化學氣相沉積法於矽基材上沉積類鑽碳膜，藉由改變沉積時間、電漿中間處理時間、電漿後處理時間及沉積過程中爐內冷卻處理，分別以表面輪廓儀量測膜厚，菲佐干涉儀量測膜表面曲度，拉曼光譜儀分析碳膜結構，奈米壓痕儀量測薄膜硬度與楊氏模數，原子力顯微鏡量測膜表面粗糙度。另外以不同比例混合甲烷及氫氣沉積類鑽碳膜做耐磨耗實驗，依不同研磨荷重及研磨時間之實驗參數，比較不同甲烷及氫氣混合比例沉積碳膜其耐磨耗特性上的差異。實驗結果顯示，隨沉積時間的增加，沉積出的碳膜膜厚增加，膜應力則於一開始沉積較薄的碳膜時有著較大的內應力，而隨著膜厚的增加，膜應力先急遽的下降，隨後趨於平緩。拉曼結果顯示，隨沉積時間的增加，碳膜中的sp2比例相對提升，顯示碳膜結構趨向類石墨結構的傾向。在相同電漿處理條件下對碳膜進行沉積後電漿處理及沉積過程中間電漿處理，其結果顯示，沉積後電漿處理對膜應力的降低有顯著的效果，而沉積過程中間電漿處理則對膜應力的降低沒有明顯的幫助。而沉積過程中爐內冷卻處理發現，中間冷卻處理會增加薄膜應力。
在固定沉積時間下氫氣含量的增加會使沉積速率下降，表面粗糙度上升，碳膜中sp2含量相對增加，應力則隨氫氣含量的增加而上升，上升至H2/CH4為10/10有最大膜內應力，隨後應力減少，硬度則以H2/CH4為0/20有最大硬度。在耐磨耗特性方面，在相同磨耗荷重與時間下，H2/CH4為0/20與6/14有較低的磨耗深度。

關鍵字

類鑽碳膜 ； 電漿處理

並列摘要

Diamond-like carbon (DLC) films were deposited on silicon substrate using a methane/hydrogen gas mixture by RF plasma enhanced chemical vapor deposition (RF-PECVD). The effects of deposition time, intermediate plasma treatment time, plasma post-treatment time and chamber cooling were investigated. The film thickness, surface curvature and microstructure of DLC films were characterized by Alpha-Step profilometer, Fizeau interferometer and Raman spectroscopy, respectively. The surface hardness, Young’s Modulus and roughness were analyzed by nano-indentation and atomic force microscopy (AFM). In addition, the wear behavior of DLC films deposited at different CH4/H2 ratios was studied by using different wear loads and time. The experimental results indicate that larger internal stress was measured in the beginning of deposition and then the internal stress decreased and remained relatively constant. The Raman results indicate that sp2 proportion in DLC films increased when the deposition time increased, indicating the graphite-like tendency in DLC films. Under the same plasma treatment conditions, significant decrease of internal stress was found for plasma post-treatment, while no significant effect of intermediate plasma treatment on the internal stress could be measured. For the results of chamber cooling, increase of deposition rate and decrease of internal stress were measured. Under fixed deposition time, as the proportion of H2 increased, the surface roughness and sp2 content increased, while the deposition rate decreased. Internal stress increased with increasing hydrogen content upto H2/CH4=10/10 and then decreased. For the hardness, the maximum value occurred at H2/CH4=0/20.

並列關鍵字

plasma treatment ； DLC

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