楔形銲嘴與超音波銲線接合過程之研究

Study on the Bonding Process of Wedges and Ultrasonic Wire Bonding

吳玉祥(Yu-Shiang Wu) ； 戴志明(Zhi-Ming Tai)

《中華技術學院學報》 36期 (2007/06) Pp. 181-196

https://doi.org/10.7095/JCIT.200706.0181

摘要

積體電路封裝為整個半導體產業後半段製程，然而封裝的型式多樣化，相對的製程精準度要求也越來越高。封裝製程中超音波銲線楔形接合，是將IC晶片與外部電路連接的一種互相連繫技術，並能提供電能輸入和訊號溝通的功能。影響接合的品質與可靠性，在於選擇合適的製程參數來銲線接合，因此利用化學蝕刻方法，來觀察銲線接合變化與界面的特性，實驗發現銲線的接合界面會形成橢圓形狀，此形狀跟超音波的功率增加有密切關係，而且對整個接合界面來講，增加超音波功率時，實際接合位置是從外圍圓周部份向中心發展，而基板的接合處面積亦隨之增加，相對地接合強度也會增加。

關鍵字

超音波楔形接合 ； 超音波的功率 ； 接合界面 ； 接合強度

並列摘要

Integrated circuit packaging is a backend process of semiconductor industry. Due to the modeling diversification of assembly, process accuracy is required to higher quality. Ultrasonic wedge bonding is one of the most important interconnection techniques for IC dies inner circuits with the outer world for the power and signal transportation. There is a significant effect of the bonding parameters to the joint quality and reliability. Therefore, the chemical etching method observes the bond configuration and interface characteristics. It is found that the bond interface form the oval-shaped with the increase of the ultrasonic power relation, furthermore, the actual joining position develop from the bond peripheral to the central, and to the whole bond interface. The bond area is increased in the substrate, and the bond strength will be increased relatively.

並列關鍵字

ultrasonic wedge bonding ； ultrasonic power ； interface ； bonding strength