晶圓輸送模組之集束型製程設備的產能分析模組

Throughput Analysis of Cluster Tools Equipment for Wafer-Transfer Module

鐘文仁(Wen-Ren Jong) ； 林彰仁(Jang-Ren Lin) ； 游欽宏(Ching-Horng Yau)

《中原學報》 29卷3期 (2001/09) Pp. 241-257

https://doi.org/10.6358/JCYU.200109.0241

摘要

鑑於全球半導體產業的蓬勃發展，以及我國晶圓廠的大量投資，促使國內開始投入IC製程設備之開發。目前半導體設備產業發展的趨勢在如何減少晶片表面污染、降低產品的製造及傳輸時間、降低設備擁有成本，以及建立簡便快捷維修能力等因素的考量下，集束型製程設備（Cluster Tools，亦稱爲整合式單晶圓製程設備）的運用，已經成爲半導體前段製程設備主要發展的結構。集束型製程設備也正朝著佔地面積(Footprint)小、多製程模組界面、高產能、低成本，以及機械手臂之高可靠度、高輸送速度的方向進行，所以在製程的分析上也面臨到前所未有的挑戰。
本文之主要目的是利用時序圖(Timing Diagram & Scheduling Diagram)，結合腔體數目、處理腔之處理時間及機械手臂的型式與輸送速度等主要參數，估算出集束型製程設備之產能値，進而建構出Φ200mm型晶圓輸送模組之集束型製程設備產能分析模組，探討與分析設備產能在各參數改變下之分佈狀況。集束型製程設備產能分析電腦模擬工具之程式建構，是依據本文所推導之產能分析模組，運用Borland C++Builder 5.0程式語言撰寫，藉著將製程參數化，讓使用者由程式界面直接輸入製程的參數後，即可快速地獲得製程的產能値，完成產能分析的工作。

關鍵字

集束型製程設備 ； 晶圓輸道 ； 時序圖

並列摘要

Taiwan industries join to develop semiconductor manufacturing equipment because the global semiconductor industry expands rapidly and Taiwan IC fabrication industry invests a lot of capital. The trend of development for semiconductor manufacturing equipment is towards reducing pollution of wafer's surface, shortening manufacturing and transportation time, decreasing cost of holding equipment, and owning simple and quick service ability. The use of cluster tools (integrated single-wafer manufacturing equipment) has become main developed configuration of semiconductor front-end manufacturing equipment. Cluster tools is evolving towards smaller footprint, more process module interfaces, higher throughput, lower cost, and higher reliability and transportation speed of robot. There fore, the analysis of processes also encounters unprecedented difficulty.
The main purpose of this paper is using timing diagram & scheduling diagram and combining with the major factors of cluster tools, number of chambers, process time of process chamber, and type and transportation speed of robot, to estimate value of throughput for cluster tools. The throughput analysis module of cluster tools for Φ200mm wafer-transfer module is built to confer and analyze distribution of throughput when each factor of cluster tools varies. The throughput analysis program of computer simulation tool is built according to throughput analysis module that derived from the context of this paper and coded to use Borland C++ Builder 5.0. Because the process is parameterized, user can obtain the value of throughput and achieve analytic work rapidly after input the factors of processes directly through user's interface of the program.

並列關鍵字

Cluster tools ； timing diagram & scheduling diagram ； wafer-transfer module