不同封裝體數量印刷電路板之振動特性與響應預測模擬比較分析

Comparison Study of Vibration Characteristics and Response Simulation for Printed Circuit Boards with Different Package Layouts

王栢村(Bor-Tsuen Wang) ； 許富翔(Fu-Xiang Hsu) ； 陶致均(Chung-Chih Tao) ； 賴逸少(Yi-Shao Lai) ； 葉昶麟(Chang-Lin Yeh) ； 李英志(Ying-Chih Li)

《中華民國振動與噪音工程學會論文集》 2008 (2008/05) Pp. 231-237

https://doi.org/10.30028/CSSVANNUAL.200805.0231

摘要

本文主要探討兩塊封裝體數量不同之印刷電路板於固定邊界下動態參數之變化，並於有限元素分析軟體中進行理論模態分析、簡諧響應分析及頻譜響應分析。在模態及簡諧響應分析部份，應用數個封裝體已模型驗證完成之結構參數套入單一封裝體有限元素模型求得自然頻率、模態振型及頻率響應函數，並進行兩塊印刷電路板之振動特性比較。在頻譜響應分析遵照JEDEC所製定之振動試驗規範JESD22-B110分別對單一及數個封裝體印刷電路板進行隨機激振下之預測模擬，可求得印刷電路板之加速度、應變功率頻譜密度函數及應力值，並進行不同封裝數量印刷電路板於頻譜分析結果之比較，結果顯示單一封裝體印刷電路板之應力值會產生中央集中現象，本文對於隨機激振測試時所採用之印刷電路板以何種封裝數量提供選擇參考依據。

關鍵字

封裝體,振動分析 ； 有限元素分析 ； 頻譜響應分析 ； 印刷電路板

並列摘要

This paper presents the comparative study of two types of printed circuit boards (PCBs) with the single and multiple packages layouts, respectively, for their dynamic performance. The theoretical modal analysis, harmonic response analysis and spectrum response analysis are carried out by the finite element analysis (FEA) via a commercial software. The structural material parameters obtained from the calibrated multi-package PCB are applied to the single one to build its FE model. Through modal analysis and harmonic response analysis, the modal parameters and frequency response functions(FRFs) can be determined and compared for their vibration characteristics of the PCBs. According to JEDEC vibration test criterion (JESD22-B110), the single-and multi-package PCBs are respectively, conducted the spectrum response analysis for random excitation conditions. The power spectral density (PSD) functions of the acceleration and strains can be obtained and used to calculate their maximum values to predict the stress levels under tests. The results showed that the single package of printed circuit board will have the stress of concentration phenomenon. The selections of types of PCBs can be advanced adopted.

並列關鍵字

package ； vibration analysis ； finite element analysis ； spectrum analysis ； printed circuit board