具封裝體PCB於熱效應及振動複合試驗之響應預測

Response Prediction for PCB with Package Subject to Thermal and Random Vibration Coupling Effects

許富翔(Fu-Xiang Hsu)

指導教授 ： 王栢村

國立屏東科技大學/工學院/機械工程系所/碩士(2009年)

https://doi.org/10.6346/NPUST.2009.00149

摘要

本文為探討印刷電路板(Printed Circuit Board, PCB)進行具熱效應之振動試驗與驗證分析。首先，以電源供應器提供直流電壓於加熱片，令加熱片產生熱量做為熱源，並探討加熱片有無貼附銅片於加熱後溫度分佈之差異性，瞭解加熱片貼附銅片可使溫度均勻分佈，將之應用於結合PCB進行自由邊界下理論與實驗之溫度場分析驗證，確認PCB受熱後之有限元素模型等效於實際結構，並探討PCB於不同邊界及不同熱效應下之耦合分析，以了解不同狀態下之振動特性，並完成模型驗證，包含：PCB、PCB貼附加熱片及PCB貼附加熱片於不同加熱溫度。由固定邊界已驗證完成之有限元素模型延伸至PCB於隨機振動響應預測，依照JEDEC所制訂之試驗規範進行隨機激振試驗，量測加速度功率頻譜密度函數，由實驗與理論分析結果可確認分析模型合理性，並可進一步進行預測PCB於不同受熱與振動耦合狀態下之應力場與疲勞破壞。本文建立振動與熱傳進行耦合分析，可協助了解PCB具熱效應於振動測試，探討PCB有無受熱破壞分析之參考。

關鍵字

印刷電路板 ； 模型驗證 ； 響應預測 ； 溫度場分析 ； 隨機振動

並列摘要

The printed circuit board (PCB) subject to vibration and thermal couple loading is of great interest. This work presents both theoretical analysis and experimental verification for PCB in heating condition subject to random vibration. First, the designed heating pad is used as the heating source by providing direct current voltages. The heating characteristics of the heating pad with and without copper shims are studied. The heating pad with the attached shim can result in uniform temperature and good for as the heating source. The finite element (FE) model of PCB in free boundary condition with and without heating is calibrated by model verification. The fixed boundary PCB can also be validated by comparing modal parameters obtained from FEA and EMA. The verified PCB model in fixed boundary is then adopted for random vibration analysis, i.e. spectrum analysis, in accordance with JEDEC specification. The experimental measurement of acceleration power spectral density (PSD) function is obtained and compared to those of FEA. Results show that the prediction from FE model agrees reasonably with experiments. The stress fields of PCB subject to vibration and thermal couple loading can be determined and evaluated for possible fatigue failures. This work presents the coupling analysis of PCB for both random excitation and thermal loading and will be beneficial to the PCB failure evaluation in compound loadings.

並列關鍵字

PCB ； model verification ； response prediction ； temperature analysis ； random vibration

參考文獻

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