- 會議論文
上級封裝體於自由邊界下之模型驗證
Model Verification of Board-level Electronic Package in Free Boundary
摘要
本文針對微小封裝體(SPBGA)結構進行振動參數之探討，經由有限元素分析軟體配合實驗模態分析進行模型驗證，進而取得等效於實際封裝體之等效有限元素模型並確認對微小物品之實驗模態量測方法及分析之準確性。在有限元素分析，首先建構符合實體結構之有限元素模型，封裝體內部結構包括：晶片、底層、化合物、錫球，以有限元素分析軟體進行模態分析及簡諧響應分析。在實驗部份，利用傳統實驗模態分析量測手法，以衝擊鎚當驅動器，而以麥克風取代加速度計當感測器進行實驗模態分析，經由實驗可獲得封裝體之模態參數，包括自然頻率、模態振型及阻尼比，在與理論有限元素分析得到之模態參數（阻尼比除外）進行比對驗證，以取得等效於實際結構之有限元素模型。經由取得封裝體之等效有限元素模型，可確立本次實驗方法之可行性，並可將其等效模型進一步應用於進行其他振動分析如響應預測等。
並列摘要
This work aims to study the vibration characteristics of a ting SPBGA package. By adopting the finite element analysis (FEA) and experimental modal analysis (EMA) on the package, the equivalent FE modal of the package can be calibrated. The EMA technique applied to a ting structure is demonstrated. In FEA, the FE model containing the details of the package, including the die, substrate, compound and solder, is established to perform the modal analysis and harmonic response analysis, respectively. For EMA, the mini-hammer is used as the actuator by roving and applying along the test grid points while the microphone is used as the sensor with the fixed location. The conventional EMA procedure is adopted to determine the modal parameters, including nature frequency, mode shape and damping ratio. Base on the experimental results, the FE modal of the package can be calibrated and said to be equivalent to the real structure. The developed methodology can be applied to other package, and the validated FE model can be utilized for further analysis, such as response prediction.