- 會議論文
半導體晶圓真空壓模設備預貼模組之模態分析與驗證
The Modal Analysis and Measurement of the Dry Film Lamination pre-cut Device of a Semiconductor Wafer Vacuum Modeling Machine
並列摘要
The objective of this study is to study the mode shape and natural frequency of the dry film lamination pre-cut device of a semiconductor wafer vacuum modeling machine. The Pro/E is employed to construct the 3D model and do the modal analysis. The simulation result is verified by modal test. The spectrum analyzer, three-axis accelerometer and percussion hammer are used to obtain the testing data. The results of this study should guide to better future designs of the equipment and are vital to reliable and safe operations of these devices.
延伸閱讀
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- Lu, C. Y. (2009). 半導體製程控制之晶圓允收測試及線上量測參數關係分析 [master's thesis, National Taiwan University]. Airiti Library. https://doi.org/10.6342/NTU.2009.02211
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