散熱鳍片幾何尺寸對高功率LED模組熱傳性能之研究

A Study of Heat-Sink Geometry on the Heat Transfer Performance of High-Power LED Modules

黃建勝(J. S. Huang) ； 李東哲(T. C. Lee) ； 蔡瑞益(R. Tsai)

《先進工程學刊》 3卷3期 (2008/06) Pp. 235-240

https://doi.org/10.29948/JAE.200806.0009

摘要

本研究使用計算流體力學軟體模擬高功率發光二極體(LED)陣列熱源搭配三種不同幾何形式散熱鰭片的熱傳性能，藉由改變散熱鰭片幾何尺寸，分析模組晶片平均接點溫度，探討LED陣列模組在正向照明及向下照明時，搭配平板型、柱型及圓柱型鰭片，分析比較LED陣列熱源的熱行為。結果顯示在正向照明且鰭片高度為10-20mm 時，搭配平板型鰭片的高功率LED模組相對於另外兩者可獲得較佳的熱性能。在向下照明時，LED模組搭配柱型或圓柱型鰭片熱性能隨著鰭片高度而提升，即使在鰭片流道縮小時，柱型及圓柱型鰭片熱性能仍較搭配平板型為佳。

關鍵字

發光二極體LED ； 接點溫度 ； 散熱鰭片 ； 自然對流

並列摘要

This study is to simulate the performance of high power LED array with threetypes of heat sink by CFD (Computational Fluid Dynamics) code. By way of changingthe geometric size of heat sink, we analyze average junction temperature of themodular chips and compare the thermal behavior of LED array module under theconditions in forward and downward lighting. The geometries of heat sink include platefin, square and cylinder pin fin. The results indicate that the LED array module showsthe better performance on using the heat sink of plate fin under the height of 10-20mmin forward lighting. In addition, the thermal performances increase with the fin heighton the heat sink of square and cylinder pin fin which are better than plate fin type evenif the flow channel width becomes narrow in downward lighting.

並列關鍵字

light emitting diode LED ； junction temperature ； heat sink ； natural convection