晶圓探針測試之溫度影響探討及改善方法

An Investigation in Temperature Effects with an Improvement Approach of Wafer Probing Test

王政龍(Cheng-Lung Wang) ； 籃山明(Shan-Ming Lan)

《先進工程學刊》 7卷3期 (2012/07) Pp. 109-114

https://doi.org/10.29948/JAE.201207.0003

摘要

在先進製程裡的測試流程，導入高低溫測試已成為測試必要課題。高低溫度變數下的測試常面臨的問題卻是良率不佳，其成因往往是接觸不良所造成。本文討論透過銲墊上針痕的觀察，提供業界面對溫度變數下除了設計端元件的溫度特性曲線之外，指出測試配件與架機設定等測試環境的因素也是影響測試良率的一個主要因素。藉由透過觀察配件的變形，比較各種造成良率降低的元素間造成的影響，針對其中某些因素提出更好的解決方案，並提出對策改善環境對良率的影響。

關鍵字

銲墊刮痕 ； 探針卡 ； 針測行程 ； 探針預熱

並列摘要

In the test flow of advanced process, testing under high and low temperature has become an essential issue. Testing variables under high and low temperature often confront with the problem of low yield ratio caused by poor contact. Through observation from probe marks on the bonding pad, this study suggests that both the temperature characteristic curve of the components at the design stage and the factors of testing environments, such as testing devices and machine settings, are main causes to affect the yield ratio of testing when facing the temperature variables. After checking the deformation from components and comparing the effects caused by various factors resulting in low yield ratio, a better solution to modify these factors is proposed to overcome the specific effects from environmental uncertainty to the yield ratio.

並列關鍵字

bonding pad scratch ； probe card ； overdrive ； probe preheating