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On-chip optical interconnect using guided-wave silicon optical bench

利用導波式矽基光學平台實現單晶片光學連接模組

摘要


Two types of on-chip optical interconnect based on guided-wave silicon optical bench (GW-SiOB) are demonstrated. Two approaches, including 3-D silicon optical waveguide and 45° micro-reflectors terminated polymer waveguides, are adopted for on-chip optical interconnect. In the 3-D silicon optical waveguide approach, the electronics and photonics are separated by SOI substrate, and the 3-D silicon optical waveguide is utilized to connect transmitting and receiving part. The clearly open eye patterns operated at a data rate of 5 Gbps is also demonstrated for such 3-D on-chip optical interconnect. In the polymer waveguide approach, the non-coplanar bending waveguide using 45° micro-reflectors terminated polymer waveguides is utilized to realize the 10-Gbps on-chip optical interconnect with VCSELs and PIN PDs surface is pretty high, the proposed method can retrieve the 3D shape precisely.

並列摘要


本論文以導波式矽基光學平台為基礎,分別採用三維矽波導光路與高分子聚合物波導光路,實現兩種不同架構之高耦光效率單晶片光連接模組。在三維矽波導架構中,採用SOI基板,將電子元件與光子元件分別建構在基板兩側,利用三維矽波導光路連接發射端與接收端,形成三維單晶片光連接模組,並驗證單通道5-Gbps的傳輸能力。在高分子聚合物波導架構中,利用具45度反射面的高分子聚合物波導,形成非共平面轉折波導光路,結合面射型雷射與光偵測器,實現單通道10-Gbps的單晶片光連接模組。

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