This paper presents a micro copper fuse developed on a glass epoxy plate using wet etching technology. The fuse structure has a length of 600 μm and a width of 80μm. The thickness of the copper layer is 30μm. Numerical simulation was studied with ANSYS software to predict the temperature distribution of the micro fuse with variable input current. Different micro fuse cross sectional areas were obtained by controlling the etching time. The fuse characteristics were evaluated experimentally using input power to the blowing current at 0.1 A increment. Measured temperature showed good agreement with the simulation data. Under safety standard test requirement, the normal rated current of the design micro fuses are 1.15 A, 1.60 A and 2.10 A at an input voltage of 3.6 V.