微波浪型鰭片散熱效能分析與研究

A study of thermal enhancement of micro-undulation-type fins

陳文宏(Wen-Hon Chen)

指導教授 ： 翁豊在

國立虎尾科技大學/工程學院/機械與機電工程研究所/碩士(2009年)

https://doi.org/10.6827/NFU.2009.00006

摘要

由於中央處理器（CPU）在高速運算時會產生大熱量，為了避免熱量累積會導致溫度過高而損壞CPU，通常在CPU會配置一散熱裝置，並以風扇控制空氣對流增加熱傳達到散熱效果。其中熱管搭配散熱鰭片的方式為現今熱傳常用的散熱裝置。熱管的設計與配置方式在整體的散熱效能上更是有極大的影響。
本研究目的是探討微波浪型鰭片的散熱效能，在合理的假設下，利用有限元素分析軟體ANSYS Multiphysics v11.0分析的方式求解流體力學（CFD），分析微波浪型散熱鰭片熱傳特性、固流體溫度分佈、鰭片之溫度分布、使用不同網格的差異來評估並與平板型鰭片做比較，進而探討整體之散熱效能表現，做出鰭片較佳形狀設計。

關鍵字

有限元素 ； 微波浪型鰭片

並列摘要

Owing to the central processing unit (CPU) Will produce great heat in high-speed computation, damaged CPU caused by heat accumulation and increased high temperature easily happened. A heat dissipation device was configured on a CPU to distribute from increasing hot with a fan, and is utilized commonly nowadays. Heat dissipation efficiency is highly influenced with the design of radiator.
The purpose of this research is to study the performance of micro-undulation-type radiator based on the reasonable assumption. A software of finite element named ANSYS Multiphysics v11.0 is used to solve computation fluid dynamics (CFD). Heat transformation properties of micro-undulation-type radiator is analyzed. Temperature profile between solid and fluid is defined. Temperature gradation is figured by different meshing technique. Optimization of the radiator can be obtained base on the performance of radiator analyse.

並列關鍵字

ANSYS ； Finite elements ； Micro-undulation-type radiator

參考文獻

[1]Ronald Pound,“ Thermal Management Balance Cooling and

size Demand ”,Electronic Packaging & Production,Vol. 25

(9).pp.112-116,September,1985.

[2]Charles E.Johnson,“ Evalution of Correlations for

Natural Convection Cooling of Electronic