降低PECVD承載腔體粉塵附著研究

A Study of Decreasing Particle Deposition in PECVD Load-Lock Chamber

黃智洋(Chih-Yang Huang)

指導教授 ： 李有璋

中原大學/工學院/機械工程研究所/碩士(2013年)

https://doi.org/10.6840/cycu201300376

摘要

粉塵一直是科技業難以控制的問題，面板廠更因為承載腔體內粉塵堆積，常造成產品的不良欠陷，故本論文主要在研究如何降低吸附於承載腔體內壁的粉塵數量，以減少不良欠陷的產生。
本研究選用電漿輔助化學氣相沉積(PECVD)設備為實驗機台，依據表面粗糙度與熱泳效應等理論基礎，利用貼膜、研磨與加熱腔壁等方式來改變腔壁表面的粗糙度與溫度，以光學微粒計數器(OPC)、掃描式電子顯微鏡(SEM)與能量散射光譜儀(EDX)進行粉塵數量與成份分析，找出有效降低粉塵附著的方法。
實驗結果顯示：（1）物體表面貼膜的粉塵吸附數量較表面研磨少，表示物體表面越光滑越能降低粉塵吸附的比例。（2）乘載腔壁的溫度越高，能產生較大的熱泳斥力將氣膠微粒推離腔壁，粉塵的吸附數量也相對越少。

關鍵字

粉塵 ； 溫度 ； 電漿輔助化學氣相沉積(PECVD) ； 粗糙度

並列摘要

In the technology industry, particle is always a big problem which can’t be neglected, especially for TFT-LCD Industry. As particles which accumulate in the vacuum chamber often causes many defects of products, but there is still no efficient way to control. Cleaning the vacuum cavity regularly is the current way to reduce the accumulation quantities. This study focused on how to reduce the quantities of particle absorbed on the inner wall of the load-lock chamber (LLC) of plasma enhanced chemical vapor deposition (PECVD) and find out a way to control the best cycle for periodic maintenance.
This study tried to increase the temperature of LLC through IR heating and reduce surface roughness of the chamber wall through grinding treatment. Then using some measurement instruments, such as particle counter and SEM/EDX, analyzed the number and ingredients of particles.
The experiments showed that the particle quantities decreased as the surface of wall become smoother and the number of particles also decreased with the increasing of temperature.

並列關鍵字

Roughness ； Temperature ； PECVD ； Particle

參考文獻

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