利用鑽石複合材料當作高亮度發光二極體的散熱管理

Thermal Management of High Brightness Light Emitting Diodes By Using Diamond Composite

胡人立

指導教授 ： 吳耀銓

國立交通大學/工學院/材料科學與工程系所/碩士(2012年)

https://doi.org/10.6842/NCTU.2012.01047

摘要

本研究的主要想法是將人造鑽石顆粒直接與晶片端接觸，提供一個導熱的通道。一共分為兩個主題：首先是在矽晶圓上製作規則的凹槽陣列，接著將人造鑽石顆粒填入凹槽，再將發光二極體結構轉移到高散熱的鑽石複合基板。主要是因為鑽石是熱的良導體，相較於原本的藍寶石基板有更佳的散熱性質，可以使元件在更高的飽和電留下驅動，以達到高功率的目標。然而鑽石的硬度極高並且無法導電，所以矽晶圓的部分就提供了後續製成的切割走道以及導電的通道。在實驗中分為圖案的選擇、填充人造鑽石、晶圓接合、雷射剝離、元件製作，分別分析討論，藉由改變製程來完成我們的想要的元件。
第二個主題是在矽晶圓上製作一個單層高密度分布的人造鑽石顆粒，利用晶元接合技術，選擇適當的接合材料做為封裝的固晶材料。在實驗中分為製作單層高密度分佈人造鑽石顆粒、焊錫與BCB接合、結構熱阻量測分別分析討論。在封裝領域提供一個新的想法藉由鑽石的高導熱性質，來提升固晶材料的散熱能力。

關鍵字

發光二極體 ； 熱管理 ； 封裝

並列摘要

In this thesis, the main idea is the artificial diamond particles directly
contact with the chip side, to provide a channel of heat dissipation. The
thesis is divided into two themes: first, the artificial diamond particles
were filled into the patterns of Si wafer, and then transferred LED to this
high thermal conductivity diamond composite substrate. Because diamond
is a good conductor of heat, compared with the sapphire substrate have a
better heat dissipation properties. The transferred LED device could be
operated in a much higher injection forward current and output power.
However, diamond is extremely hard and not conductive, so the part of Si
wafer is the role as cutting the aisle in follow-up processes and conductive
channel. We have several issues including: pattern choice, fill artificial
diamonds, wafer bonding, laser lift-off, and device fabrication. We change
experimental conditions and processes for our desired device.
The second theme is the production of a single layer of high density distribution of artificial diamond particles on Si wafer, and using wafer
bonding technique, and selecting the appropriate bonding material as
die-attach material. The experiment is divided into production of a single
layer of high density distribution of artificial diamond particles on Si wafer,
solder and BCB bonding ,and structural thermal resistance measurement
were analyzed and discussed. Finally, we propose a new idea in electric
packaging by using diamond which has high thermal conductivity to
improve the ability of heat dissipation of die-attach material.

並列關鍵字

LED ； thermal management ； heat dissipation ； packaging

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