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研究生: 蕭鈞庭
Hsiao, Chun-Ting
論文名稱: 應用超快雷射技術於石墨烯奈米銀金屬粒/聚醯亞胺複材之熱檢測元件探討
Application of Ultra-Fast Laser Technique on Thermal Sensing Device of Graphene-Silver Metal Nanoparticles/Polyimide Composites
指導教授: 張天立
Chang, Tien-Li
學位類別: 碩士
Master
系所名稱: 機電工程學系
Department of Mechatronic Engineering
論文出版年: 2020
畢業學年度: 108
語文別: 中文
論文頁數: 114
中文關鍵詞: 超快雷射奈米金屬粒子石墨烯熱檢測元件氣體感測
英文關鍵詞: Ultrafast laser, Metal nanoparticles, Graphene, Heating sensing device, Gas detection
DOI URL: http://doi.org/10.6345/NTNU202001563
論文種類: 學術論文
相關次數: 點閱:55下載:0
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  • 本研究利用超快雷射製程技術(Ultrafast laser processing technique)進行微結構(Microstructures)之熱元件(Heating device)製作及其特性之探討,以應用於氣體檢測(Gas detection)。在本研究中會使用超快雷射直寫技術分別於石墨烯(Graphene)/聚醯亞胺(Polyimide, PI)基材及奈米銀(Silver nanoparticles, AgNPs)/石墨烯/PI基材進行雷射測試,固定重複率為300 kHz、加工次數3次下,在振鏡掃描速度為500 mm/s及雷射能量密度為2.45 J/cm2,完成薄膜製程及元件製作,並依此參數製作不同寬度熱檢測元件。研究顯示在相同寬度5 mm下,石墨烯/PI基板給予功率6.10 W時,最高溫約134 ℃;奈米銀/石墨烯/PI基板給予功率5.83 W時,最高溫約104 ℃。另外,在相同寬度6 mm下,石墨烯/PI基板給予功率為6.10 W時,最高溫約110 ℃;奈米銀/石墨烯/PI基板給予功率4.48 W時,最高溫約113 ℃。進一步本研究顯示在寬度6 mm之奈米銀/石墨烯/PI基材熱檢元件,能給予較少功率,產生出100 ℃以上溫度,且基材彎曲90 o時,溫度仍能維持在100 ℃以上。同時,本研究搭配設計所製作的指叉狀(Interdigitated)電極元件進行氣體量測,研究顯示在一氧化氮(Nitric oxide, NO)濃度為650 ppm時,該元件電阻值可從78 上升至85 ,氣體響應值約9 %,且氣體響應值會隨氣體濃度增加而上升。

    This study proposes the ultrafast laser processing technique to form heating device with microstructures and investigate its characteristics for applying for gas detection. Herein, the ultrafast laser direct-writing technique can be used on graphene/polyimide (PI) and graphene/silver nanoparticles (AgNPs)/PI respectively to perform the tests. Under the fixed repetition rate set to 300 kHz with processing of 3 times, the thin-film process and device were be performed at the controlled scanning speed of the galvanometer and laser fluence, which can be 500 mm/s and 2.45 J/cm2, respectively. According to these parameters, the thermal sensing device with different width can be fabricated. The study revealed that under the width of 5 mm electrode for graphene/PI substrate was achieved the highest temperature of 134 oC when being given the power of 6.10 W. And then, the same design width for graphene/silver nanoparticles/PI substrate was achieved the highest temperature of 104 oC when being given the lowest power of 5.83 W. On the other hand, it can be seen that under the width of 6 mm for graphene/PI substrate was achieved the highest temperature of 110 oC when being given the power of 6.10 W. And then, the same design width for graphene/silver nanoparticles/PI substrate was achieved the highest temperature of 113 oC when being given the lowest power of 4.48 W. Furthermore, the experimental results demonstrated that the electrode structure with 6 mm width electrode on the graphene/nano-silver/PI substrate was the highest temperature over 100 oC with the lowest power, in which the temperature of its device substrate can still be maintained at 100 oC when it was bent at 90 o. Simultaneously, this study was used the interdigitated electrode structure for gas detection. The results showed that when the concentration of nitric oxide (NO) is 650 ppm, the resistance value of electrode-structure device can be raised from 78  to 85  (the gas response value wss approximately 9 %). The experimental results showed that the value of gas response will increase as the gas concentration increases.

    第一章 緒論 1 1.1研究背景與目的 1 1.2 微熱檢測元件簡介 2 1.3氣體檢測簡介 2 1.4雷射製程技術簡介 3 1.5導電元件材料簡介 4 第二章 文獻回顧 11 2.1超快雷射製程技術簡介 11 2.2 超快雷射製程回顧 11 2.3微型加熱元件回顧 13 2.3.1石墨烯材料 13 2.3.2導電電極材料 14 2.4氣體感測元件回顧 15 第三章 研究方法與設計 36 3.1實驗設計 36 3.2石墨烯薄膜製作 36 3.3氣體感測器之感測電極設計 37 3.4 超快雷射製程 37 3.4.1雷射加工剝離閥值 38 3.4.2雷射加工之重疊率與脈衝數 38 3.5 微型加熱元件設計 40 3.5.1 熱阻抗檢測分析 40 3.6奈米銀/石墨烯薄膜製作 41 3.7氣體感測晶片檢測分析 42 3.8實驗量測設備 42 第四章 結果與討論 54 4.1 導電材料分析 54 4.1.1奈米銀特性分析 54 4.1.2導電薄膜旋塗轉速、時間、厚度與電阻值關係 55 4.2 超快雷射薄膜加工剝離閥值、重疊率及脈衝數探討 55 4.2.1石墨烯/PI基板之雷射加工剝離閥值 56 4.2.2石墨烯/PI基板之雷射加工重疊率與脈衝數 57 4.2.3 奈米銀/石墨烯/PI基板之雷射加工剝離閥值 57 4.2.4奈米銀/石墨烯/PI基板之雷射加工重疊率與脈衝數 58 4.3 微型加熱器設計加工精密度探討 59 4.3.1 石墨烯/PI基板之微型加熱指與叉狀結構元件製作加工 59 4.3.2 奈米銀/石墨烯/PI基板之微型加熱與指叉狀結構元件製作加工 59 4.4 功率與溫度分析 60 4.4.1 石墨烯/PI基板之功率與溫度分析 60 4.4.2 奈米/銀石墨烯/PI基板之功率與溫度分析 61 4.4.3 微型加熱元件之功率與溫度比較 61 4.5 氣體檢測分析 62 第五章 結論 106 5.1 結論 106 5.2 建議與未來展望 107 參考文獻 108

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