本研究採真空硬銲方式進行探討以商用銀-銅-鈦活性填料接合雙極板-不銹鋼430SS與陽極8YSZ之行為。在430SS/活性填料/8YSZ的液/固反應中,主要生成相為TiO與Cu-Ti-O化合物,隨著溫度與持溫時間的增加,Cu-Ti-O化合物會逐漸溶回去填料基地內。在靠近不鏽鋼端的生成物為Cu-Ti化合物。隨著反應溫度與時間的增加,Ti原子會不斷的往界面擴散,填料基地組織最後只剩下富Cu區、富Ag區與Cu-Ag共晶。將真空硬銲的結果進行700與750℃時效反應,反應時間為24小時。實驗結果顯示在長時間的高溫時效後,在靠近8YSZ端的界面,TiO相會轉為穩定的TiO2相,而Cu與Ag原子亦會擴散穿越過氧化鈦層。Cu原子隨即與存在於界面的O原子反應生成CuO與Cu2O。Ag原子仍然與富Ag區存在於界面。同樣的,O原子亦會擴散進入填料基地與原先的富Cu區反應生成CuO。隨著反應溫度與時間的增加,TiO2反應層會逐漸溶回基地形成鬆散結構。
Used as the sealing filler. The 8YSZ/Cusil ABA/ 430SS sandwich couples are bonded by a vacuum brazing method. We investigated the interfacial reactions and aging behavior of the sandwich couples. A eutectic structure of Ag and Cu, TiO, Cu3Ti3O and Cu2Ti4O phases were observed in the 8YSZ/ Cusil ABA/ 430SS sandwich couples reacted at 833℃ for 60 min. When these specimens were set at 700℃ in the atmosphere for 24 h, Ag-rich phase and CuO dendrite phases between the 8YSZ and 430SS, and CuO, Cu2O and TiO2 layers close to 8YSZ were observed. Increasing the brazing temperature to 883℃, the Cu3Ti3O and the Cu2Ti4O phases were dissolved back to the molten braze alloy. There are two intermetallic compounds, the TiO and the Cu-Ti phases formed at the interfaces along the 8YSZ and 430SS boundaries. When the 8YSZ/Cusil ABA/430SS couples were brazed at 883℃ for 60 min and then aged at 750℃ for 24 h, the TiO2/CuO/Ag-rich/CuO/ TiO2 structures were observed between 8YSZ and 430SS.