強化深度40 μm之化學強化玻璃劃線切割研究

Study of Scribing Process Applies on Chemically Strengthened Glass of Depth of Compressive Layer 40 μm

張詠迪(Yung-Di Chang)

指導教授 ： 廖運炫

國立臺灣大學/工學院/機械工程學研究所/碩士(2016年)

https://doi.org/10.6342/NTU201603827

摘要

化學強化玻璃表面有一因離子交換所產生的壓應力層，因此較強化前有較高的硬度、強度，於劃線切割製程上有一定的難度。本研究使用兩種不同度之刀輪，進行強化深度40 μm化學強化玻璃劃線切割，於玻璃同一路徑上，進行兩次劃線，並加入振動輔助，利用第一道劃線所產生的溝槽，使得第二道劃線時，玻璃表面chipping不增加太多的情況下，達到自動裂片，且最大chipping為110 μm。
本研究亦使用雙角度碳化鎢刀輪，並搭配振動輔助，進行強化深度40 μm化學強化玻璃劃線切割，刀輪前端較尖的刀刃刺入玻璃表面產生較深的中央裂紋，而較鈍的刀面壓於玻璃表面，降低玻璃表面劃線後所產生的表面chipping，可以得到比單一角度刀輪劃線所產生的表面chipping更小，中央裂紋度更深，其劃線結果之表面最大chipping為122 μm，中央裂紋深度為193 μm。

關鍵字

化學強化玻璃 ； 刀輪劃線 ； 振動輔助 ； 碳化鎢刀輪 ； 裂片製程

並列摘要

The chemically strengthen glass, with a compressive stress profile on its surface and which is caused by ion-exchange process, has higher crack resistance and scratch resistance. In this study, two scribing wheels with different angles were applied to cut chemically strengthen glass of depth of compressive layer 40 μm. Scribing wheels scribed with the assistance of vibration on the same path twice. First, scribing process caused a gap on the surface of glass. Then, the second scribing process was applied, and the decreasing of amount of chipping was found. Also, the glass separated automatically and the max size of chipping is 110 μm.

In this study, two-angle WC scribing wheel was also applied to cut chemically strengthen glass of depth of compressive layer 40 μm with the assistance of vibration. The front tip of scribing wheel pierced through the glass surface and caused deeper median crack. Then, the second flank surface pressed on the glass surface. Compared to the chipping amount caused by single-angle scribing wheel, two-angle scribing wheel causes less chipping, deeper median crack and minimizes the size of chipping. The max size of chipping is 122 μm and the median crack is 193 μm.

並列關鍵字

chemically strengthened glass ； glass scribing ； vibration assisted ； WC scribing wheel ； breaking process

參考文獻

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