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  • 學位論文

影像感測元件廠商之經營發展策略:以S公司為例

The Business Development Strategy of a CMOS Image Sensor Company : A Case Study of Company “S”

指導教授 : 陳忠仁

摘要


CMOS Image Sensor(CIS)影像感測器技術在西元2000年後隨著半導體產業與封測產業的成熟使得商業化的大量生產得以實現。同時隨著網際網路、高速寬頻與無線網路包含Wifi與3G/4G的環境發展,各項行動裝置例如智慧型手機的快速成長,物聯網與車用電子對影像感測器的運用,都提供了影像感測器市場成長的動力。整體影像感測器市場在2014年已達104億美金,根據Yole與IHS的報告,預測感測器市場將以年複合成長率(CAGR) 10%的速度成長。在市場成長過程中,吸引眾多供應商投入,其中包含以IDM的垂直整合形式,與以Fabless無晶圓廠設計公司及晶圓代工廠共同投資設置後段供應鏈形成策略聯盟的模式。業者彼此競爭激烈,市場排名改變迅速。 本研究運用CIS產業的五力分析,研究現今的市場領導者Sony 元件事業群競爭策略,價值鏈模型分析,探討其在CIS市場的策略定位,技術,與未來成長策略等議題。 本研究顯示Sony元件事業群藉由CIS產品的垂直整合,提供了技術力的突破,將本身由IDM的運作轉向為Semi-IDM的形式,保存了本身CIS關鍵核心能力並進一步能運用晶圓代工業成本優勢。創造了本身兼具技術領先、成本低廉與龐大產能的競爭優勢。Sony在未來的發展中,在成長漸緩的行動裝置市場以聚焦低成本策略發展,另一方面允用聚焦差異化在高成長的安控/車用市場。兩者成為Sony在未來CIS市場的競爭策略。 除了CIS影像感測器之外,需要一定元件尺寸,或其製程技術需求進展較為緩慢者但具有光機電整合需求,例如設計中需要特殊封裝測求的微機電,生物電子晶片等。在這些領域的競爭廠商,可參考CIS產業的競爭模式,選擇適切的資源調整與模式設定來提升競爭力。

關鍵字

CIS 五力分析 價值鏈 垂直整合

並列摘要


In year 2000, the development of semiconductor and package industry lead the CMOS Image sensor technology commercialization. With the fast deployment of eco-system for internet, high speed broadband and wireless network like WIFI and 3G/4G, the mobile device industry including mobile phone, IOT and Automobile electronics adopt the sensor application provide the market growth momentum of CMOS Image Sensor market. The whole senor market reach 10.4Billion USD in year 2014. According to the analysis report of IHS and Yole , they both predict the market will enjoy 10% compound annual growth rate (CAGR). There are many players join in the market competition in the form of IDM with vertical integration form, or Fabless IC design house, or and in the form of horizontal collaboration by the strategy alliance of Fabless IC design and Semiconductor foundry for backend service. The market share of each player changed from year 2000 to 2015 under severe competition. In this case, I use the five power analysis on current market leader Sony Device Segment competition strategy, vertical integration strategy, Value chain model. I also discuss the strategy position, technology development and supply chain integration related topics. The result shows that Sony Device Group CIS product line adopt vertical integration, it enhance the capability of the technology innovation. Sony successfully migrate their IDM mode to semi-IDM mode. They keep the CIS core competence and further take advantage of cost merit by the economic scale of the semiconductor foundry business. They create the technology leadership, cost advantage and volume capacity to support their competition power in the market. In the future industry competition, Sony adopt cost focus in the slow growth momentum mobile handset market and focus on differentiation in the fast growing Security and Automobile market. Except CIS, other IC like the MEMS, Bio-Chip, in these segments which need certain device size, or special request of process/package, or optical, electrical and mechanical integration, this study show they can consider about the business models in CIS industry. Select proper resource adjustment and business model setting to create their core competence.

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被引用紀錄


鄧國星(2017)。晶圓代工產業的成長維度與高階人才策略:以台積電為例〔碩士論文,國立臺灣大學〕。華藝線上圖書館。https://doi.org/10.6342/NTU201700886

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