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  • 學位論文

應用蒙地卡羅模擬於電子元件組裝空焊良率分析

Applying Monte Carlo Simulation to Analyze the Open Scenario in the Assembly of Electronic Components

指導教授 : 黃乾怡

摘要


近年環保意識抬頭,綠色封裝(Green package)議題廣為重視,使得傳統錫鉛迴焊製程 (Solder Reflow)將由無鉛製程(Lead Free)所取代,因此,許多元件必須將溫度提高至260℃下組裝,因元件和印刷電路板(Printed Circuit Board; PCB)在高溫下產生翹曲(Warpage)情形,使元件和印刷電路板間距增加,造成元件發生空焊並影響組裝良率,然而,常需要使用嘗試錯誤法或實驗設計方法,決定實驗因子以及水準,以求得最佳製程參數,但實驗設計卻往往受限於樣本數不足,以致於難以推估實際生產良率。故模擬法可代替傳統實驗法,為一低成本之方案。 本研究期望針對伺服器產品中BGA、QFP及DFN-8元件分析其組裝製程,考量元件特定材料選用、元件特徵(錫球高度)及製程參數條件(錫膏厚度)下, PCB及元件翹曲程度(曲率半徑)進而模擬空焊發生機率,運用蒙特卡羅模擬法建立一套預測空焊良率系統的架構與模式,再進行敏感度分析決定調整參數之優先順序。模擬結果發現,採用目前生產條件下0.8 Pitch BGA、1.0 Pitch BGA、QFP及DFN-8迴焊中元件空焊焊點良率分別為99.99904%、99.9999%、99.99996%及100%,計算得整板組裝空焊良率為98.6576%。研究成果提出調整各參數順序為錫膏印刷厚度平均數、元件置放時錫球陷入錫膏深度百分比、錫球高度規格界限、錫膏印刷厚度標準差,以提升焊點良率。

並列摘要


As the environmental awareness continues to rise, the issue of green package is serious importance. While the traditional solder reflow process is replaced by the lead free process, the reflow temperature will raise to 260℃. Because the component and board warpage emerge in high temperature, the tolerance between component and board increases. The phenomenon creates open joint to influence the yield. The design of experiments and trial and error are typically used to determine the desired process parameters and resulted assembly yield. Nevertheless, there are several factors involved and samples are limited for conducting the experimentation. Therefore, the simulation methodology that is a low cost program alternates conventional experiment methodology. The BGA, QFP, DFN-8 components of the server product are under considerate. After this research considers the assembly process parameters, component variations, component and board warpage, establishing the prediction model of the open joint. Monte Carlo simulation technique was used to predict the solder joint yield. And then sensitivity analysis determines the sequence of improvement parameters. After the reflow procedure, the simulated results of component yield that include 0.8 Pitch BGA, 1.0 Pitch BGA, QFP and DFN-8 are 99.99904%, 99.9999%, 99.99996% and 100%. The open scenario in the assembly of electronic components is 98.6576%. The sequence of adjustment process parameter is the average of printed soldering paste thickness, the depth that solder ball fall into solder paste percentage of pick-and-place, the specification limiter of the solder ball and the standard deviation of solder paste.

參考文獻


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