應用六標準差與實驗設計改善手插件電解電容之通孔上錫率-以電源供應公司為例

Improving the Through Hole Fill Rate of Hand Insertion Electrolytic Capacitor Using-Six-Sigma and Design of Experiment - A Case Study of Power Supply Company

黃彥綸(Yen-Lun Huang)

指導教授 ： 黃惠民

中原大學/電機資訊學院/工業與系統工程研究所/碩士(2015年)

https://doi.org/10.6840/cycu201500388

摘要

印刷電路板裝配(Printed Circuit Board Assembly, PCBA)對製造業而言是一種普通常見的工藝技術，製程包括表面貼焊技術(Surface Mount technology, SMT)與傳統插件元件(Dual In-line Package, DIP)兩部分。針對各類零件的焊接品質判定與接受程度，是依據國際電子工業聯接協會（Institute of Printed Circuits or Association Connecting　Electronics Industries, IPC）制定的IPC-A-610國際規範。面臨電子產品趨於小型化設計的時代，PCBA製程能力技術也必須相對地提高，使產品整體品質都能符合各項檢驗規範要求，對電子製造業而言是相當重要的環節。
本研究所要探討的部分是個案公司內，關於電解電容通孔上錫率不足IPC-A-610國際規範的75%通孔上錫率之原因，透過六標準差的流程架構理念，應用界定、衡量、分析、改善、控制（Define-Measure-Analyze-Improve-Control, DMAIC）五個改善流程步驟觀點並搭配田口實驗設計手法來作為製程設計改善的研究模式，經由與專案委員一同腦力激盪下繪製特性要因圖（Causes & Effects Chart），篩選出重要影響度高的因子，藉由設計過的實驗板找出設備面與設計面最具顯著因素及決定最適製程設計參數組合，將實驗結果實際導入產品再次驗證其效益。實驗結果顯示，最適製程設計參數是有效改善通孔上錫率。最後將之標準化並持續追蹤。

關鍵字

田口方法 ； 實驗設計 ； 六標準差 ； 製程改善

並列摘要

Printed Circuit Board Assembly (PCBA) is a common manufacturing process in industries which consists of two main activities: Surface Mount Technology (SMT) and Dual In-line Package (DIP). The welding quality criteria for all components in PCBA are following the international standards from IPC-A-610, which is based either from Institute of Printed Circuits or Association Connecting Electronics Industries. Nowadays, since the electronic products are compact and become smaller in size, the PCBA technology is improved accordingly.
The purpose of this study is to investigate the cause of 75% through-hole fill rate fails to meet the standard of IPC-A-610. The methodology used in this study is to apply five steps of Six Sigma concept (DMAIC – Define, Measure, Analyze, Improve, Control) and Taguchi design of experiment to determine the most influential factors. The most influential factor will later be tested on dummy board, so that the key factors between device and design level can be determined. Experimental results show that the optimal process design parameter is effective in improving the through hole fill rate. Finally, standardization and examination of the procedures and are also presented, respectively.

並列關鍵字

Six-Sigma ； Design of Experiment ； Taguchi Method ； Process Improvement

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