一體成型鋁合金冷板設計與製程之研究

The Study on the Designs and Process of Integrated Cold-plate of Al-alloy

王昶評(Chang-Ping Wang)

指導教授 ： 蘇程裕

國立臺北科技大學/機電學院/製造科技研究所/碩士(2014年)

摘要

本研究探討6061鋁合金以純鋅膜進行暫態液相擴散接合，其中接合溫度分別於420℃、450℃及480℃持溫時間為60分鐘及120分鐘後，進行T6熱處理，並針對接合形貌、機械性質進行探討，研究結果得知，在6061鋁合金之接合界面間，形成一反應層，且無明顯缺陷，經由附著力測試破壞後，將破斷面進行定性及定量檢測，該反應層界面破斷面幾乎為Al-Zn或Al-Zn-Mg固溶相所組成。
當接合溫度較低時，容易於接合處形成缺陷，故後續熱處理時，大氣中水氣或氧氣容易使該缺陷擴大。而較高接合溫度下，其接合界面反應層較為完整，大氣不易使之惡化，並經由熱處理後，更可提升其強度與硬度。藉由附著力測試結果得知，界面反應層與接合溫度對於本實驗之擴散接合製程都是非常重要的因子，在本實驗之試片482(接合溫度480℃、持溫時間2 hr)，有最高之強度值28.21 MPa，且經熱處理後，強度值可達48.15 MPa。
冷板為液冷式散熱系統中關鍵元件之一，因其直接接觸電子元件，因此其熱傳性能與密封性要求甚高，而冷板在開發製作上，長久受限於加工技術的限制，始終無法有效提升產品的可靠度以及性能。故本研究將6061鋁合金擴散接合整合進冷板的開發上，並以堆疊式流道進行設計，藉由鑲入片型結構將其分為兩部分：下層流道以及上層流道；下層流道分別以圓柱型、平行式以及W字型進行設計，配合適當之上層流道設計以求得最低熱阻之冷板。期間並以商用軟體ICEPAK進行模擬分析，以得最佳之流道設計，並實際以CAD/CAM分別製作冷板，並以擴散接合技術，將冷板之上蓋、底板與片型流道進行一次性的接合後，進行其熱性質檢測，並與模擬結果相互驗證。

關鍵字

6061鋁合金 ； 鋅金屬 ； 擴散接合 ； 冷板

並列摘要

This study of transient liquid phase of diffusion bonding of 6061 alloy with pure Zinc filler is successfully bonded. The bonding temperature of the process was adjusted at 420℃, 450℃ and 480℃ for 1 hour and 2 hours separately. Meanwhile, we did T6 heat treatment of 6061 alloy for the specimens. Afterwards, we investigated the influence on mechanical characteristics and the morphology of the joints. The results indicate that the primary interfacial reaction layer is composed of Al-Zn or Al-Zn-Mg solid solution.
At lower bonding temperature, the bonding zone will form the defects easier, therefore when the joints get T6 heat treatment, the defect will be deteriorated by moisture or oxygen let the mechanical characteristics of the joints reduce, instead the higher bonding temperature can let the defects lower, and get T6 heat treatment, the strength and hardness of the joints will be stronger. When the bonding conditions were controlled at 480℃ for 2 hours, its highest strength is reached 28.21 MPa and the strength after T6 heat treatment is 48.15 MPa.
Cold-plate is one of the most important elements of liquid cooling system, because Cold-plate element contacts the processing chip straightly, so it requires good sealing ability and high heat transfer. Currently, the development of Cold-plate has been limited to the machining technology, lead to the performance and reliability of the products cannot be improved.
To ameliorate the above problems, we use transient liquid phase of diffusion bonding process in our development of Cold-plate, and design “Stacked Cold-plate,” through insert sheet-type channel let internal chamber be divided into two layers. In this research there are three types for bottom layer channel is respectively Pillar-type(P), Fin-type(F) and W-shape-type(W), and with suitable top layer channel. In order to compare the performance of heat transfer, flow field and optimum design, these channels was conducted by simulation software, ICEPAK.
Finally, we actually manufacture optimum Cold-plate designs of the three by CAD/CAM, and let upper sheet, bottom sheet and inner sheet-type channel integrally molded by diffusion process ,afterwards measure the thermal properties to verify with the simulation results.

並列關鍵字

Al-Alloy ； Zinc filler ； Diffusion Bonding ； Cold-plate

參考文獻

[33]鄧治東、劉建辰、粘嘉原，微電子散熱模組流道設計與散熱效能之研究，中國機械工程學會第二十四屆全國學術研討會論文集，桃園，2007。

[1]L. B. Kish, "End of Moore’s law：thermal death of integration in micro and nano electronics," ELSEVIER Physics Letters A, 305(3-4), 2002, pp.144-149.

[2]C. Belady, "Cooling and power considerations for semiconductors into the next century," International Symposium on Low Electronics and Design (ISLPED’1), 2001, pp. 100-105.

[3]Q. Yu, M. Shiratori, ” Fatigue-strength prediction of microelectronics solder joints under thermal cyclic loading,” IEEE Trans on Components And Packaging technologies, 20(3), 1997, pp.226-273.

[6] 李明哲，氣室表面改質對鋁合金均熱板性能之研究，碩士論文，國立臺北科技大學，台北，2012。