智慧型手機電池蓋尺寸變異對策與探討

Solutions and Investigation for Dimension Variation of Smart Phone Battery Cover

許惠君(HUI-CHUN HSU)

指導教授 ： 韓麗龍

國立臺北科技大學/機電學院/製造科技研究所/碩士(2012年)

摘要

智慧型手機外殼常需設計成形狀複雜的薄殼產品，不同位置因不一樣的收縮而造成尺寸差異。本研究使用Moldex3D CAE軟體與田口方法中的L9直交表，探討智慧型手機電池蓋的上端與下端的橫向位移之差異(亦即大小頭)。模座的設計為二板模，模穴數為一模一穴，澆口數目為兩個進料點之潛伏式澆口。直交表包含五個控制因子：澆口位置、水路溫度、保壓壓力、保壓時間、料溫。
直交表分析結果顯示，「保壓壓力」是影響橫向位移最顯著的控制因子，與變異分析的結果相吻合。CAE分析結果顯示，在優化之製程參數組合條件下，橫向位移獲得有效改善，並且控制在0.20 mm以內。在優化的製程參數組合之下，實作的成品之橫向位移也是比原始設計有顯著得改善。

關鍵字

智慧型手機 ； 橫向位移 ； 潛伏式澆口 ； 保壓壓力 ； 變異分析

並列摘要

External part of the smart phone was often designed with complex shape and thin shell. The final dimension may be different due to the shrinkage difference at the various positions. Moldex3D CAE software and L9 orthogonal array of Taguchi method was used to investigate the transverse displacement difference between the top end and bottom end of the smart phone battery cover. Two-plate mold, one cavity, two gates, and submerge gate was designed in this study. Five control factors include gate location, coolant temperature, packing pressure value, packing during time, and melting temperature.
Orthogonal arrays analysis show the packing pressure value is the most significant control factor that affects the transverse displacement. This result coincides with the analysis of variance. The transverse displacements can be improved and controlled within 0.20 mm under optimized process condition through CAE analysis. Furthermore, the transverse displacements of actual specimens, which produce with injection machine, have the significant improvement than the original process design.

並列關鍵字

smart phone ； transverse displacement ； submerge gate ； packing ； analysis of variance

參考文獻

[16] 程御賢，數位相框前框翹曲量之最佳化設計，碩士論文，國立臺北科技大學製造科技研究所，台北，2011。

[1] Chen, R. S., H. H. Lee and C. Y. Yu, Application of Taguchi’s Method on the Optimal Process Design of an Injection Molded PC/PBT Automobile Bumper, Composite Structures, Vol. 39, pp209-214,1997。

[2] W. C. Bushko, V. K. Stokes, Solidification of thermo viscoelastic melts, two Effect of Processing Conditions on Shrinkage and Residual Stress, Polym. Eng. Sci., Vol. 35, 1995.

[3] K. M. B. Jansen, D. J. V. Dijk, M. H. Huesselman, Effect ofprocessing conditions on shrinkage in injection molding, Polymer Engineering and Science, Vol.38, No.5, pp.838-846, 1998.

[4] Ming-Chih Huang, Ching-Chih Tai, The effective facors in the warpage problem of an injection-molded part with a thin shell feature, 1999.