添加氮化鋁和奈米碳管導熱片之性質研究

陳柏舟

doi:10.6841/NTUT.2013.00078

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添加氮化鋁和奈米碳管導熱片之性質研究

The Study in the Properties of A Thermal Pad filled with Aluminium Nitride and Carbon Nanotubes

陳柏舟 , Masters　　Advisor：周文祥　　

繁體中文 DOI： 10.6841/NTUT.2013.00078

熱傳導；導熱片；奈米碳管； Thermal Conductivity ； Thermal Pad ； Carbon nanotubes

Abstract │ Reference (73) │ Altmetrics

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With the evolution of process technology, electronic components can’t effectively remove the heat, so often have hot spots, then electronic components due to thermal damage, however, generally thermal pad of the thermal conductivity of are lower than 1 W/mK, therefore the paper discusses how to effectively enhance the thermal conductivity of thermal pad, and then enhance the method using different thermal conductivity of powder and surface functionalization on treatment, the ratio of the two-phase powder. The results that the nitrogen aluminum powder and the pure carbon nanotubes prepared thermal pad, the highest thermal conductivity can be achieved 1.192 W/mK (50 Vol.%) and 1.344 W/mK (40 Vol.%), when surface functionalization treatment of thermal pad, their thermal conductivity can be increased approximately 58% (1.888 W/mK) and 28% (1.854 W/mK), another using the ratio of the two-phase powder, when the volume fraction of 50 %, the nitrogen of aluminum and the pure carbon nanotubes mix to prepared by thermal pad, the highest thermal conductivity can reach to 1.613 W/mK, while the nitrogen of aluminum and functionalized carbon nanotubes mix to thermal pad and functionalized nitrogen of aluminum and the pure carbon nanotubes mix to thermal pad, thermal conductivity can be increased about 43% (2.306 W/mK) and 40% (2.252 W/mK) and thermal pad through 50 hot and cold shock, thermal conductivity decrease of approximately 6%.

Reference ( 73 ) 〈TOP〉

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[7] J. P. Gwinn and R. L. Webb, "Performance and testing of thermal interface materials," Microelectronics Journal, vol. 34, no. 3, 2003, pp. 215-222.
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[8] M. Grujicic, "The effect of thermal contact resistance on heat management in the electronic packaging," Applied Surface Science, vol. 246, no. 1-3, 2005, pp. 290-302.
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