DOI
stands for Digital Object Identifier
(
D
igital
O
bject
I
dentifier
)
,
and is the unique identifier for objects on the internet. It can be used to create persistent link and to cite articles.
Using DOI as a persistent link
To create a persistent link, add「http://dx.doi.org/」
「
http://dx.doi.org/
」
before a DOI.
For instance, if the DOI of an article is
10.5297/ser.1201.002
, you can link persistently to the article by entering the following link in your browser:
http://dx.doi.org/
10.5297/ser.1201.002
。
The DOI link will always direct you to the most updated article page no matter how the publisher changes the document's position, avoiding errors when engaging in important research.
Cite a document with DOI
When citing references, you should also cite the DOI if the article has one. If your citation guideline does not include DOIs, you may cite the DOI link.
DOIs allow accurate citations, improve academic contents connections, and allow users to gain better experience across different platforms. Currently, there are more than 70 million DOIs registered for academic contents. If you want to understand more about DOI, please visit airiti DOI Registration ( doi.airiti.com ) 。
The Study in the Properties of A Thermal Pad filled with Aluminium Nitride and Carbon Nanotubes
陳柏舟 , Masters Advisor:周文祥
繁體中文
DOI:
10.6841/NTUT.2013.00078
熱傳導 ; 導熱片 ; 奈米碳管 ; Thermal Conductivity ; Thermal Pad ; Carbon nanotubes


- [1] J. P. Gwinn and R. L. Webb, "Review of heat transfer technologies in electronic equipment," ASME J. Electronic Packaging, vol. 117, 1995, pp. 333-339.
連結: - [4] S. Iijima, "Helical microtubules of graphitic carbon," Nature, vol. 354, no. 7, 1991, pp. 56-58.
連結: - [5] C. W. Chan, "Thermal conductivity of B-C-N and BN nanotubes," Americam Vacuum Society, vol. 23, no. 5, 2005, pp. 1883-1886.
連結: - [7] J. P. Gwinn and R. L. Webb, "Performance and testing of thermal interface materials," Microelectronics Journal, vol. 34, no. 3, 2003, pp. 215-222.
連結: - [8] M. Grujicic, "The effect of thermal contact resistance on heat management in the electronic packaging," Applied Surface Science, vol. 246, no. 1-3, 2005, pp. 290-302.
連結: