stands for Digital Object Identifier
and is the unique identifier for objects on the internet. It can be used to create persistent link and to cite articles.
Using DOI as a persistent link
To create a persistent link, add「http://dx.doi.org/」
before a DOI.
For instance, if the DOI of an article is 10.5297/ser.1201.002 , you can link persistently to the article by entering the following link in your browser: http://dx.doi.org/ 10.5297/ser.1201.002 。
The DOI link will always direct you to the most updated article page no matter how the publisher changes the document's position, avoiding errors when engaging in important research.
Cite a document with DOI
When citing references, you should also cite the DOI if the article has one. If your citation guideline does not include DOIs, you may cite the DOI link.
DOIs allow accurate citations, improve academic contents connections, and allow users to gain better experience across different platforms. Currently, there are more than 70 million DOIs registered for academic contents. If you want to understand more about DOI, please visit airiti DOI Registration （ doi.airiti.com ） 。
- 1. C.-Y. Su, S. Tsao, L.-Y. Huang and C.-T. Hu, "Distinguish Various Types of Defects in Bonded Wafer Pairs with the Dynamic Blade Insertion Method", Journal of The Electrochemical Society 157 (8), H792-H795 (2010).
- 2. J. Haisma and G. A. C. M. Spierings, "Contact Bonding, Including Direct-Bonding in a Historical and Recent Context of Materials Science and Technology, Physics and Chemistry: Historical Review in a Broader Scope and Comparative Outlook", Materials Science and Engineering: R: Reports 37 (1-2), 1-60 (2002).
- 3. Q.-Y. Tong and U. Gosele, Semiconductor Wafer Bonding: Science and Technology. (JOHN WILEY & SONS, INC., USA, 1999).
- 4. R. G. Horn, "Surface Forces and Their Action in Ceramic Materials", Journal of the American Ceramic Society 73 (5), 1117-1135 (1990).
- 5. K.-T. Wan, D. T. Smith and B. R. Lawn, "Fracture and Contact Adhesion Energies of Mica-Mica, Silica-Silica, and Mica-Silica Interfaces in Dry and Moist Atmospheres", Journal of the American Ceramic Society 75 (3), 667-676 (1992).
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